Lead SI Engineer: High-Speed Interconnects & Validation

NVIDIA Corporation; Santa Clara (CA); Presencial; USD 136.000 - 265.000; Jornada completa

Descripción de la vacante

NVIDIA Corporation in Santa Clara is seeking an experienced Signal Integrity Engineer to craft SI solutions for high-speed interfaces and complex system designs. You will model vias, connectors, sockets, and substrates in 3D EM tools, and run system-level simulations for NVLink, PCIe5, USB4, and other interfaces.

You'll improve SI models using lab measurements and updates to modelling tools, and help create board and package SI guidelines with post-layout SI extractions.

Formación

• BS/MS-Electrical Engineering or equivalent experience with 3+ years in industry.
• Strong background in applied electromagnetics, transmission line theory and signal processing.
• Experience with SI on standards like PCIe, USB, SATA, HDMI, HBM, DDR5, GDDR6, LPDDR5X, etc.

Responsabilidades

• Craft signal integrity solutions for complex system designs.
• Model vias, connectors, sockets, breakouts and system components in 3D EM tools.
• Run system-level SI simulations for high-speed interfaces (NVLink 200Gbs+, PCIe5, USB4, etc).
• Improve SI models using lab data and tool updates.
• Develop substrate and board SI guidelines; post-layout SI extractions.
• Automate simulations and data gathering; visualize results with JMP or MATLAB.
• Collaborate across functions to optimize package, PCB, ASIC and mixed-signal circuits.

Conocimientos

Applied electromagnetics

Transmission line theory

Signal processing

Interconnect modeling

PCIe/USB/SAS signaling

System timing / loss budgeting

Lab data-driven analysis

Educación

BS/MS-Electrical Engineering or equivalent

Herramientas

ANSYS HFSS

ANSYS Q3D

ANSYS SIWAVE

ANSYS2D

VNA

TDR

DSO

ParBERT

ADS

Cadence Allegro

JMP

MATLAB

Descripción del empleo

NVIDIA Corporation in Santa Clara is seeking an experienced Signal Integrity Engineer to craft SI solutions for high-speed interfaces and complex system designs. You will model vias, connectors, sockets, and substrates in 3D EM tools, and run system-level simulations for NVLink, PCIe5, USB4, and other interfaces.

You'll improve SI models using lab measurements and updates to modelling tools, and help create board and package SI guidelines with post-layout SI extractions.