Senior Process Engineer — Advanced Packaging & Flip Chip

Actalent; Carlsbad (CA); On-site; USD 150,000 - 195,000; Full time

Benefits offered by this job

Relocation assistance

Stock options

401(k) plan

Company-paid healthcare

Job summary

Actalent is seeking a Senior Process Engineer to lead the development, optimization, and scaling of advanced manufacturing and packaging processes for optoelectronic products in Carlsbad, CA. You will own process development for flip chip assembly and thermo-compression bonding, with 2.5D/3D packaging initiatives and transition to high-volume production.

You will guide DOE studies, Yield analysis, and reliability tasks while collaborating with cross-functional teams and suppliers. Expect <20% travel to Asia and domestic sites as needed.

Qualifications

• 5+ years of process engineering experience within semiconductor, photonics, optoelectronics, or advanced manufacturing environments.
• Hands-on experience with die-level flip chip packaging beyond SMT/PCB assembly.
• Experience with Die-to-Wafer or Wafer-Level Packaging processes.
• Thermo-Compression Bonding (TCB) setup, optimization, and troubleshooting.
• Proven ability to bring manufacturing processes to production scale.
• DOE, FMEA, yield analysis, and SPC methodologies.
• Experience with JMP, Minitab for data analysis and optimization.
• Knowledge of packaging reliability principles and failure analysis.

Responsibilities

• Develop, refine, and optimize manufacturing processes for optoelectronic and silicon photonics products.
• Design and implement advanced packaging, focusing on flip chip and TCB.
• Support 2.5D/3D packaging architectures for next-gen products.
• Plan experiments and DOE studies to improve yield and quality.
• Monitor yield, process health, and failure trends for improvements.
• Perform root-cause analysis and resolve manufacturing issues.
• Create SOWs and project plans for development initiatives.
• Collaborate with suppliers, OSATs, and contract manufacturers.
• Scale processes from development to high-volume production.
• Contribute to pilot line buildout and advanced packaging capabilities.
• Apply statistical methods to yield analysis and SPC.
• Provide technical leadership in advanced packaging.

Skills

Flip chip packaging

Thermo-Compression Bonding

DOE / Design of Experiments

FMEA

Statistical process control

JMP / Minitab

Packaging reliability

Cross-functional collaboration

Travel readiness

Education

Bachelor's degree in Engineering

Tools

JMP

Minitab

Job description

Actalent is seeking a Senior Process Engineer to lead the development, optimization, and scaling of advanced manufacturing and packaging processes for optoelectronic products in Carlsbad, CA. You will own process development for flip chip assembly and thermo-compression bonding, with 2.5D/3D packaging initiatives and transition to high-volume production.

You will guide DOE studies, Yield analysis, and reliability tasks while collaborating with cross-functional teams and suppliers. Expect <20% travel to Asia and domestic sites as needed.