Lead Packaging Engineer: RF & Mixed-Signal

Skyworks Solutions, Inc.; Austin (TX); On-site; USD 123,000 - 255,000; Full time

Benefits offered by this job

Healthcare benefits

401(k) plan

Employee stock purchase plan

Paid time off

Job summary

Skyworks Solutions, Inc. seeks a Principal Packaging Engineer in Nashua, NH or Austin, TX to lead package-engineering for new product introductions, supporting design, material selection, assembly readiness, qualification and production release.

The role spans SOIC, lead-frame, QFN, LGA, BGA and WLCSP packaging, requiring close collaboration with R&D, device and process engineering, module design, program management, operations, internal and external partners to ensure quality, performance, and

Qualifications

• Bachelor's degree in Mechanical Engineering or a related engineering discipline.
• 10+ years of relevant semiconductor packaging experience.
• Experience with SOIC, QFN, lead-frame, LGA, BGA, and WLCSP semiconductor assemblies.
• Knowledge of JEDEC, IATF, and AEC requirements.
• Strong leadership, communication, and collaboration in cross-functional teams.
• Ability to work autonomously and manage multiple projects.

Responsibilities

• Provide package-design support and material-selection guidance to enable high-yielding, reliable, and cost-effective products.
• Develop and introduce new packaging technologies while supporting existing and legacy products.
• Collaborate with cross-functional teams to confirm adherence to design and technology rules and to define technology choices, timelines, milestones, and deliverables for new product launches.
• Lead end-to-end product readiness and the transition from development to production release, coordinating Design, Process, Test, Operations, and Module teams to meet quality, performance, and schedule objectives.
• Work with Skyworks’ internal assembly operation in Mexicali and external OSAT partners across Asia to support assembly-site selection, qualification, and execution.
• Lead product-readiness reviews covering technology, capability, capacity, and cost for each product release.
• Conduct design, process, and technology risk assessments and coordinate reliability activities throughout technology development, NPI, and ramp-up to support Cpk and yield targets.
• Identify risks and challenges in the NPI process and develop practical mitigation plans.
• Collaborate openly with cross-functional teams to manage projects, resolve technical and operational problems, and address critical issues.
• Prepare clear status reports and executive-level updates on product readiness, risks, decisions, and recovery actions.

Education

Bachelor's degree in Mechanical Engineering or a related engineering discipline

10+ years semiconductor packaging experience

Job description

Skyworks Solutions, Inc. seeks a Principal Packaging Engineer in Nashua, NH or Austin, TX to lead package-engineering for new product introductions, supporting design, material selection, assembly readiness, qualification and production release.

The role spans SOIC, lead-frame, QFN, LGA, BGA and WLCSP packaging, requiring close collaboration with R&D, device and process engineering, module design, program management, operations, internal and external partners to ensure quality, performance, and