Principal Packaging Engineer

Skyworks Solutions, Inc.; San Jose (CA); Hybrid; USD 129,400 - 247,800; Full time

Benefits offered by this job

Healthcare benefits

401(k) plan with company match

Employee stock purchase plan

Paid time off including parental leave

Job summary

A leader in analog semiconductors is seeking a Principal Packaging Engineer in San Jose, CA, to support new product development of RF System in Package (SiP) modules. The role involves defining package requirements, owning product development from feasibility to production, and leading strategic packaging initiatives. The ideal candidate should have extensive experience in semiconductor packaging technologies and a strong project management background. This position offers a competitive salary and benefits, fostering an environment for meaningful contributions and global collaboration.

Qualifications

• Minimum 12 years experience in semiconductor packaging technology.
• Strong project management and communication skills.
• Expertise with overmolded laminate module packaging processes.

Responsibilities

• Define and implement the package requirements with IC design teams.
• Ownership of product from feasibility stage to high volume production.
• Develop new assembly technologies and run process DOE's.

Skills

Project management

Communication skills

Expertise in packaging processes

Education

BS Degree in Electrical Engineering, Mechanical Engineering, Process Engineering, or Material Science

Tools

Cadence Allegro platform

Mentor Xpedition platform

Job description

If you are looking for a challenging and exciting career in the world of technology, then look no further. Skyworks is an innovator of high-performance analog semiconductors whose solutions are powering the wireless networking revolution. Through our broad technology expertise and one of the most extensive product portfolios in the industry, we are Connecting Everyone and Everything, All the Time.

At Skyworks, you will find a fast-paced environment with a strong focus on global collaboration, minimal layers of management, and the freedom to make meaningful contributions in a setting that encourages creative thinking. We are excited about the opportunity to work with you and glad you want to be part of a team of talented individuals who together are changing the way the world communicates.

Requisition ID: 77070

Description

• We are seeking a Principal Packaging Engineer with expertise in advanced laminate packaging technologies to support new product development (NPI) of RF System in Package (SiP) modules. Candidate will be the RF packaging interface between multi-functional groups within Skyworks and internal/external manufacturing.
• This position offers significant opportunities for growth, including leading strategic packaging initiatives and influencing Skyworks packaging technology roadmap. Leadership experience, either as a program manager, people manager, or technical lead is a strong plus.
• On-site location is flexible. Desired location in San Jose CA or Irvine CA.

Responsibilities

• Working with IC design teams to define and implement the package requirements.
• Ownership of specific product from feasibility stage to high volume production.
• Ensuring that DFM/BKM is implemented for assembly yield, cost, and reliability.
• Developing new assembly technologies, running process DOE’s, identifying new materials and equipment, reliability testing, and qualification of new assembly process.

Required Experience And Skills

• BS Degree in either Electrical Engineering, Mechanical Engineering, Process Engineering, or Material Science.
• Minimum 12 years experience (or MS and 8 years) in semiconductor packaging technology.
• Strong project management and communication skills (verbal, written, and presentation).
• Expertise with overmolded laminate module packaging processes: SMT, Wirebonding, Die Attach, and Molding.
• Knowledge of various assembly processes: Flip Chip Bumping, Fan Out, WLCSP, BGA, Module Level Shielding, and IPDs.
• Experience in Advanced RF SiP Modules: Dual Side BGA, Dual Side Mold Grid Array, EMI Shielding.
• Experience working with OSAT Assembly Factories in Asia.

Desired Experience And Skills

• Solid understanding of Design Rules Check and Design for Manufacturing.
• Hands on experience with assembly process/equipment.
• Experience in package design and proficient in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP) or Mentor Xpedition platform tools.
• Understanding of RF products and concepts is highly desired.
• Experience with Failure Analysis.
• Understanding of Module and Board Level Reliability requirements.
• Understanding of manufacturing of organic laminate technologies.
• Experience with Lead-Frame Packaging.
• Prior R&D experience of advanced packaging concepts.

The typical base pay range for this role across the U.S. is currently USD $129,400 - $247,800 per year. Starting base pay will depend on relevant experience and skills, training and education, business needs, market demands, the ultimate job duties and requirements, and work location. Skyworks has different base pay ranges for different work locations in the U.S. Benefits include access to healthcare benefits (including a premium-free medical plan option), a 401(k) plan and company match, an employee stock purchase plan, paid time off (including vacation, sick/wellness, parental leave), among others. Employees are eligible to participate in an incentive plan, and certain roles are also eligible for additional awards, including recognition and stock. These incentives and awards are based on individual and/or company performance.

Skyworks is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, age, sex, sexual orientation, gender identity, national origin, disability, protected veteran status, or any other characteristic protected by law. Skyworks strives to create an accessible workplace; if you need an accommodation due to a disability, please contact us at [e-mail].