Senior Manager, RF SiP Packaging & Process Innovation

Skyworks Solutions, Inc.; Irvine (CA); On-site; USD 143,000 - 286,000; Full time

Benefits offered by this job

Healthcare benefits

401(k) plan

Employee stock purchase plan

Paid time off

Job summary

Skyworks Solutions, Inc. is seeking an experienced Senior Manager, Package Process Development to lead RF SiP packaging technology development and industrialization.

The role drives NTI activities, process innovation, and robust manufacturing processes enabling high-volume production of next-generation RF modules and SiP products. You will collaborate with product design, package design, technology development, suppliers, and manufacturing teams to accelerate readiness and product

Qualifications

• MS or PhD in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or related field.
• 12+ years semiconductor packaging experience with at least 3 years in a leadership role.
• Strong hands-on RF SiP package development and assembly process engineering experience.

Responsibilities

• Lead NTI activities for advanced RF SiP packaging platforms.
• Develop process roadmaps and technology strategies for future RF module requirements.
• Drive DFM/ DFA/ DFR initiatives during product development.
• Partner with cross-functional teams to transition technology to production.
• Own development and optimization of RF SiP assembly processes (Die Attach, Flip Chip, Wire Bonding).
• Define process windows, critical parameters, and control methodologies.
• Lead DOE, process characterization, root cause analysis, and yield improvements.
• Establish process specs, qualification plans, and manufacturing standards.
• Work with OSATs and suppliers to implement scalable production solutions.

Skills

RF SiP packaging

Leadership

NTI programs

Process characterization

DOE / SPC / FMEA

Education

MS/PhD in Electrical Engineering or related

Job description

Skyworks Solutions, Inc. is seeking an experienced Senior Manager, Package Process Development to lead RF SiP packaging technology development and industrialization.

The role drives NTI activities, process innovation, and robust manufacturing processes enabling high-volume production of next-generation RF modules and SiP products. You will collaborate with product design, package design, technology development, suppliers, and manufacturing teams to accelerate readiness and product