Lead Packaging Architect for 2.5D/3D ICs

Broadcom Inc.; Irvine (CA); On-site; USD 91,000 - 146,000; Full time

Benefits offered by this job

Medical, dental, and vision plans

401(K) with company matching

Employee Stock Purchase Program (ESPP)

Paid holidays and sick leave

Vacation time

Job summary

Broadcom Inc. is seeking a talent in advanced packaging design with hands-on experience in GDSII-based physical layout. The role involves architecting advanced packaging solutions and defining design rules for new technology.

Qualifications include a Bachelor’s degree in Engineering with 5+ years of experience or a Master’s degree with 3+ years. The position offers a competitive salary range of $91,000 – $146,000 along with a comprehensive benefits package.

Qualifications

• 5+ years of related experience with a Bachelor’s degree.
• 3+ years of related experience with a Master’s degree.

Responsibilities

• Architect advanced packaging solutions for product requirements.
• Define design rules for new technology.
• Design test vehicles to support technology development.
• Generate design collaterals for new technology.
• Drive design-for-yield and design-for-cost activities.

Skills

Advanced packaging design

GDSII-based physical layout

2.5D/3D packaging architecture

.mcm-based layout

Education

Bachelor’s degree in Engineering

Master’s degree in Engineering

Job description

Broadcom Inc. is seeking a talent in advanced packaging design with hands-on experience in GDSII-based physical layout. The role involves architecting advanced packaging solutions and defining design rules for new technology.

Qualifications include a Bachelor’s degree in Engineering with 5+ years of experience or a Master’s degree with 3+ years. The position offers a competitive salary range of $91,000 – $146,000 along with a comprehensive benefits package.