Senior IC Packaging & Layout Engineer (2.5D/3D)

Draper; Cambridge (MA); On-site; USD 82,000 - 220,000; Full time

Benefits offered by this job

Work-life balance programs

Employee clubs

Discounts to local museums

Job summary

Draper in Cambridge, MA is seeking an IC Packaging Design & Layout Engineer to create advanced IC packaging solutions that meet performance, power, size, and reliability targets for Draper’s next-generation hardware platforms.

The role requires deep expertise in package architecture, high-speed layout, signal integrity analysis, and design for manufacturability, collaborating with silicon, mechanical, and manufacturing teams to deliver manufacturable package designs that align with the product

Qualifications

• Bachelor's degree in electrical engineering or related field. Advanced degree preferred.

Responsibilities

• Translate project requirements into hardware architectures with cross-functional teams.
• Innovatively solve issues and drive completion of projects.
• Build, debug, and test prototypes and deliverable hardware.
• Prepare documentation for manufacturing and provide ongoing support.
• Research and enable innovative solutions for cutting-edge designs.
• Collaborate with engineers to develop reliable, cost-effective end solutions.
• Mentor less experienced teammates and provide constructive feedback.
• Support business development and proposal activities.

Skills

High density packaging

Siemens Xpedition

High-speed design

Signal integrity best practices

Education

Bachelor's degree in Electrical Engineering

Tools

Siemens Xpedition

Ansys SIwave

HFSS

Hyperlynx

Job description

Draper in Cambridge, MA is seeking an IC Packaging Design & Layout Engineer to create advanced IC packaging solutions that meet performance, power, size, and reliability targets for Draper’s next-generation hardware platforms.

The role requires deep expertise in package architecture, high-speed layout, signal integrity analysis, and design for manufacturability, collaborating with silicon, mechanical, and manufacturing teams to deliver manufacturable package designs that align with the product