Lead Optical Packaging Architect for 2.5D/3D ICs

MediaTek; San Jose (CA); On-site; USD 188,000 - 356,000; Full time

Benefits offered by this job

Health insurance

401K plan

Parental leave

Job summary

MediaTek is seeking an experienced technologist to join our global advanced packaging team and contribute to optical-interconnect packaging and 2.5D/3D/3.5D solutions for AI and Datacenter/HPC products. You’ll bridge internal and external partners to drive roadmaps from PoC to high volume production.

You will lead development, validation and qualification efforts, collaborate across design, test, and manufacturing, and manage production issues with suppliers to ensure on-time goals in a dynamic

Qualifications

• MS/PhD in Mechanical Engineering, Optical Engineering, Material Science or related field.
• 5+ years' experience in optical device development, alignment processes, and mass production management.
• Experience bringing new tech from PoC to high volume manufacturing.
• Hands-on debugging ability with strong problem-solving skills.
• Excellent communication and presentation skills in English.

Responsibilities

• Develop and validate optical interconnect solutions for 2.5D/3D/3.5D packaging architectures.
• Collaborate with package/chip design, thermal modeling, substrate engineering, PI/SI, and test engineering teams.
• Conduct DFM analysis and create design rule sets for 3DIC/CPO packages; document results.
• Coordinate with Technology, Design, Test, Quality, GSM, and Manufacturing Ops to meet requirements and execute MP plans.
• Manage technology development, yield improvement, and production issue troubleshooting with suppliers.
• Develop fundamental optical characterization methodologies for components and processes.
• Oversee Package Qualification, NPI and high volume manufacturing readiness.

Skills

Optical Dev

Mass production

Debugging

English fluency

Project mgmt

Education

MS/PhD in Mechanical/Optical/Materials

Tools

DFM analysis tools

Job description

MediaTek is seeking an experienced technologist to join our global advanced packaging team and contribute to optical-interconnect packaging and 2.5D/3D/3.5D solutions for AI and Datacenter/HPC products. You’ll bridge internal and external partners to drive roadmaps from PoC to high volume production.

You will lead development, validation and qualification efforts, collaborate across design, test, and manufacturing, and manage production issues with suppliers to ensure on-time goals in a dynamic