Packaging Manager/Director

MediaTek Research Lab Inc.; San Jose (CA); On-site; USD 200,550 - 322,250; Full time

Benefits offered by this job

Comprehensive health insurance

401(k)

Parental leave

Job summary

MediaTek Research Lab Inc. is seeking a visionary manager or director for Advanced Packaging Development in San Jose, California. In this key role, you will lead the development of cutting-edge 2.5D and 3D packaging solutions for various business units. Responsibilities include collaborating with cross-functional teams and managing supplier relationships to ensure high-quality manufacturing processes.

The ideal candidate will possess over 5 years of management experience in packaging, deep technical expertise in advanced packaging technologies, and strong supply chain management capabilities. A competitive salary of $200,550-$322,250 along with a bonus and benefits package is offered.

Qualifications

• Minimum 5 years of experience managing a packaging development team.
• Deep knowledge of 2.5D/3D package architectures.
• Strong understanding of signal integrity and thermal management.

Responsibilities

• Lead the development of advanced packaging technologies.
• Manage third-party relationships with suppliers and partners.
• Monitor project progress and supply chain performance.

Skills

Management Skills

Advanced Packaging Expertise

Signal Integrity (SI)

Power Integrity (PI)

Thermal Management

Conflict Management

Supply Chain Management

Job description

Mediatek is seeking a visionary manager or director to join our US team for Advanced Packaging Development. In this strategic role, you will lead and drive the development of cutting‑edge 2.5D/3D packaging solutions critical to our Automotive, Datacenter/HPC, AI, and Computing business units. You will serve as the key technical coordinator to bridge internal cross‑functional teams, external customers, and external manufacturing partners. Your team’s mission is to solve complex integration challenges (CoWoS, EMIB, SoIC, HBM, FCBGA, FCCSP, HBPOP) and lead the packaging roadmap from concept through to mass production. We are looking for an owner who combines deep technical expertise with strategic thinking, supply chain management experience, and a solid commitment to customer obsession.

Roles and Responsibilities

• Leadership and Development: Lead the development of advanced packaging technologies and collaborate closely with IP, ASIC design, package design, Signal Integrity (SI), Power Integrity (PI), Thermal and modeling technologies, Product Engineering, and Test Engineering teams to enable innovative solutions.
• Supply Chain and Technical Partner Management: Establish and manage third‑party relationships with substrate suppliers, OSATs, assembly, material and equipment partners. Drive material selection and BOM optimization to ensure manufacturability to meet electrical, mechanical, thermal, and system‑level requirements.
• Communication Skill: Monitor and report project progress, supply chain performance, and manufacturing metrics to senior management. Serve as the primary interface for external customers and key enablement partners to ensure alignment on product quality, reliability, system needs, and optional requirements.
• Travel: Domestic and international travel required (10‑15%) to closely collaborate with partners/supplies, customer engagements, and internal team alignment.

Main Requirements and Qualifications

• Management Skills, Capabilities and Leadership; Minimum 5 years of experience managing a packaging development team. Ability to set a clear goal and a strategic roadmap for team development, mentor junior engineers and influence without direct authority. Strong conflict management and resource planning abilities. Demonstrate ownership, high standards, strategic thinking, and customer obsession.
• Expertise in Advanced Packaging: Deep hands‑on knowledge of 2.5D/3D package architectures including CoWoS, EMIB, SoIC, CoW, WoW, PoP, and integration with HBM.
• Technical Fundamentals: Working knowledge of package design, electrical signal integrity (SI), power integrity (PI), thermal management, and thermomechanical principles. Strong understanding of inherent 2.5D/3D challenges (warpage, CTE mismatch, stress, interconnects, etc.).
• Process and Assembly Knowledge: Experience with wafer‑level processes, package assembly flows, and substrate technologies.
• Legacy Packaging Process and Failure Analysis: Understanding of legacy packaging technologies, package failure mechanisms, and demonstrated ability to perform quick, root‑cause problem solving.
• Supply Chain Management and Relationship: Proven ability to manage BOM, procurement, logistics, and inventory. Exceptional ability to build and maintain strong relationships with key enablement partners and customers.
• Salary range: $200,550- $322,250
• Employee may be eligible for performance bonus, short and long term incentive programs. Actual total compensation will be dependent upon the individual’s skills, experience and qualifications. In addition, MediaTek provides a variety of benefits including comprehensive health insurance coverage, life and disability insurance, savings plan, company paid holidays, sick leave, vacation time, parental leave, 401(k) and more.
• MediaTek is an Equal Opportunity Employer that is committed to inclusion and diversity to all, regardless of age, ancestry, color, disability (mental and physical), exercising the right to family care and medical leave, gender, gender expression, gender identity, genetic information, marital status, medical condition, military or veteran status, national origin, political affiliation, race, religious creed, sex (includes pregnancy, childbirth, breastfeeding and related medical conditions), and sexual orientation.