Optical 3D Packaging Technologist

MediaTek; San Jose (CA); On-site; USD 188,000 - 356,000; Full time

Benefits offered by this job

Health insurance

401K plan

Parental leave

Job summary

MediaTek is seeking an experienced technologist to join our global advanced packaging team and contribute to optical-interconnect packaging and 2.5D/3D/3.5D solutions for AI and Datacenter/HPC products. You’ll bridge internal and external partners to drive roadmaps from PoC to high volume production.

You will lead development, validation and qualification efforts, collaborate across design, test, and manufacturing, and manage production issues with suppliers to ensure on-time goals in a dynamic

Qualifications

• MS/PhD in Mechanical Engineering, Optical Engineering, Material Science or related field.
• 5+ years' experience in optical device development, alignment processes, and mass production management.
• Experience bringing new tech from PoC to high volume manufacturing.
• Hands-on debugging ability with strong problem-solving skills.
• Excellent communication and presentation skills in English.

Responsibilities

• Develop and validate optical interconnect solutions for 2.5D/3D/3.5D packaging architectures.
• Collaborate with package/chip design, thermal modeling, substrate engineering, PI/SI, and test engineering teams.
• Conduct DFM analysis and create design rule sets for 3DIC/CPO packages; document results.
• Coordinate with Technology, Design, Test, Quality, GSM, and Manufacturing Ops to meet requirements and execute MP plans.
• Manage technology development, yield improvement, and production issue troubleshooting with suppliers.
• Develop fundamental optical characterization methodologies for components and processes.
• Oversee Package Qualification, NPI and high volume manufacturing readiness.

Skills

Optical Dev

Mass production

Debugging

English fluency

Project mgmt

Education

MS/PhD in Mechanical/Optical/Materials

Tools

DFM analysis tools

Job description

MediaTek is seeking an experienced technologist to join our global advanced packaging team. You will be a key contributor in the development of optical-interconnect packaging and 2.5D/3D/3.5D packaging solutions (CoWoS, SoIC, COUPE, CPO, HBM, FCBGA) that support our AI, Datacenter/HPC product families. The role bridges internal cross-functional groups, external customers, and technology providers to deliver optical and advanced packaging solution and roadmap from prove of concept (PoC) to high volume production (HVM).

Responsibilities

• Develop and validate optical interconnect including Co-Package-Optics (CPO), Fiber Attachment Unit (FAU), Optical Engine (OE), etc. package/assembly solutions for 2.5D/3D/3.5D package architectures.
• Collaborate with package/chip design, thermal modeling, substrate engineering, PI/SI, and test engineering teams to deliver optical interconnect technology.
• Conduct DFM (Design-for-Manufacturability) analysis, generate design rule sets for 3DIC/CPO packages and documentations.
• Collaborate with internal cross-functional partners, including Technology, Design, Test, Quality, GSM and Manufacturing Operation to meet product requirements (RFI, RFQ) and execute MP plans.
• Manage technology development, yield improvement, and production issue troubleshooting together with technology suppliers: Foundries, OSATs and substrate vendors.
• Develop/establish fundamental optical characterization methodology for key components and package/assembly process.
• In charge of Package Qualification, New Product Introduction (NPI) and HVM.

Main Requirements and Qualifications

• MS/PhD degree in Mechanical Engineering, Optical Engineering, Material Science and/or related field.
• 5+ years' experience in relevant fields - Optical device development, optical alignment process development, and mass production management.
• Participate in the process of bringing up a new technology from the PoC stage to high volume manufacturing.
• Proven ability to hands-on debug with strong problem-solving ability.
• Excellent communication/presentation skills in English.
• Manage projects Independently with on time delivery.
• About 10-15% international travel required.
• Location can be in San Jose (US), HishChu (TW).
• For San Jose position, Salary range: $188,000- $356,000
• Employee may be eligible for performance bonus, short and long term incentive programs. Actual total compensation will be dependent upon the individual's skills, experience and qualifications. In addition, MediaTek provides a variety of benefits including comprehensive health insurance coverage, life and disability insurance, savings plan, Company paid holidays, Sick Leave, Vacation time, Parental leave, 401K and more.
• MediaTek is an Equal Opportunity Employer that is committed to inclusion and diversity to all, regardless of age, ancestry, color, disability (mental and physical), exercising the right to family care and medical leave, gender, gender expression, gender identity, genetic information, marital status, medical condition, military or veteran status, national origin, political affiliation, race, religious creed, sex (includes pregnancy, childbirth, breastfeeding and related medical conditions), and sexual orientation.