Lead Hardware Engineer, Advanced CPO Systems (Equity)

Broadcom Inc.; Wayne (CA); On-site; USD 144,000 - 230,000; Full time

Benefits offered by this job

Medical, dental and vision plans

401(K) participation including company

Employee Stock Purchase Program (ESPP)

Employee Assistance Program (EAP)

company paid holidays

paid sick leave

vacation time

Job summary

Broadcom Inc. is seeking a Technical Lead for Advanced Co-Packaged Optics (CPO) to spearhead end-to-end development of next-generation photonic/electronic systems.

You will lead a cross-functional R&D team across Optical, Electrical, Mechanical, Firmware, and Software to meet aggressive performance and cost goals. The role requires guiding architecture, design, validation, and production, including prototype bring-up and mass-production transfer, with a focus on timely milestones and robust

Qualifications

• Extensive experience guiding cross-functional R&D teams.
• Strong background in photonic/electronic integration and packaging.

Responsibilities

• Lead CPO product architecture, subsystems, and interfaces.
• Drive design tradeoffs balancing performance, manufacturability and cost.
• Provide guidance on photonic/electronic IC design and packaging.
• Coordinate R&D teams to achieve unified goals.
• Oversee schematic capture, simulation, SI/PI analysis, layout, and integration.
• Manage prototype bring-up, debugging, and validation testing.
• Develop and drive project plans from concept to mass production.
• Implement robust product development lifecycle processes.
• Lead pilot builds and mass-production transfers.
• Define test software requirements and manufacturing test/tuning algorithms.
• Provide technical support to customers and resolve field issues.

Skills

Cross-Functional Leadership

Photonic/Electronic IC design

System architecture

Fiber alignment

Education

Bachelor's degree in engineering or sciences

Master's degree

Ph.D.

Tools

Schematic capture

Circuit simulation

PCB layout

Job description

Broadcom Inc. is seeking a Technical Lead for Advanced Co-Packaged Optics (CPO) to spearhead end-to-end development of next-generation photonic/electronic systems.

You will lead a cross-functional R&D team across Optical, Electrical, Mechanical, Firmware, and Software to meet aggressive performance and cost goals. The role requires guiding architecture, design, validation, and production, including prototype bring-up and mass-production transfer, with a focus on timely milestones and robust