Principal Hardware Engineer - Advanced Co-Packaged Optics

Broadcom; San Jose (CA); On-site; USD 144,000 - 230,000; Full time

Job summary

Broadcom is seeking a Technical Lead for Advanced Co-Packaged Optics (CPO) in California. You will spearhead end-to-end development of cutting-edge CPO products by leading a cross-functional R&D team spanning photonic/electronic systems, architecture, validation, and production.

The role requires driving design tradeoffs, coordinating Optical/Mechanical/Firmware/PCB interfaces, and ensuring on-time milestones.

Qualifications

• Bachelor's degree in engineering or sciences.
• 12+ years related experience (or 10+ with a Master's, 7 with a PhD).
• Experience leading cross-functional R&D teams.

Responsibilities

• Define CPO product architecture, subsystem interfaces (Optical/Mechanical/Firmware/PCB), and critical design tradeoffs.
• Lead hardware design activities and system integration.
• Coordinate R&D teams to meet milestones and unified product goals.
• Oversee prototype bring-up, system-level troubleshooting and validation testing.
• Develop and drive project plans from concept to mass production.

Skills

Cross-Functional Leadership

Hardware Design

Project Management

Education

Bachelor's degree in engineering or sciences

Master's degree or PhD with relevant experience

Job description

Broadcom is seeking a Technical Lead for Advanced Co-Packaged Optics (CPO) in California. You will spearhead end-to-end development of cutting-edge CPO products by leading a cross-functional R&D team spanning photonic/electronic systems, architecture, validation, and production.

The role requires driving design tradeoffs, coordinating Optical/Mechanical/Firmware/PCB interfaces, and ensuring on-time milestones.