Hardware Engineer

Broadcom Inc.; Wayne (CA); On-site; USD 144,000 - 230,000; Full time

Benefits offered by this job

Medical, dental and vision plans

401(K) participation including company

Employee Stock Purchase Program (ESPP)

Employee Assistance Program (EAP)

company paid holidays

paid sick leave

vacation time

Job summary

Broadcom Inc. is seeking a Technical Lead for Advanced Co-Packaged Optics (CPO) to spearhead end-to-end development of next-generation photonic/electronic systems.

You will lead a cross-functional R&D team across Optical, Electrical, Mechanical, Firmware, and Software to meet aggressive performance and cost goals. The role requires guiding architecture, design, validation, and production, including prototype bring-up and mass-production transfer, with a focus on timely milestones and robust

Qualifications

• Extensive experience guiding cross-functional R&D teams.
• Strong background in photonic/electronic integration and packaging.

Responsibilities

• Lead CPO product architecture, subsystems, and interfaces.
• Drive design tradeoffs balancing performance, manufacturability and cost.
• Provide guidance on photonic/electronic IC design and packaging.
• Coordinate R&D teams to achieve unified goals.
• Oversee schematic capture, simulation, SI/PI analysis, layout, and integration.
• Manage prototype bring-up, debugging, and validation testing.
• Develop and drive project plans from concept to mass production.
• Implement robust product development lifecycle processes.
• Lead pilot builds and mass-production transfers.
• Define test software requirements and manufacturing test/tuning algorithms.
• Provide technical support to customers and resolve field issues.

Skills

Cross-Functional Leadership

Photonic/Electronic IC design

System architecture

Fiber alignment

Education

Bachelor's degree in engineering or sciences

Master's degree

Ph.D.

Tools

Schematic capture

Circuit simulation

PCB layout

Job description

Technical Lead - Advanced Co-Packaged Optics (CPO)

Core Mission: Spearhead the end-to-end development of cutting-edge CPO products by leading a cross-functional R&D team. Drive architecture, design, validation, and production of integrated photonic/electronic systems to meet aggressive performance, cost, and timeline goals.

Key Responsibilities

• Cross-Functional Team Leadership: Define CPO product architecture, subsystem interfaces (Optical/Mechanical/Firmware/PCB), and critical design tradeoffs.
• Champion design decisions balancing performance, manufacturability, and cost.
• Provide expert guidance on photonic/electronic IC design, optical engine packaging, and substrate/PCB development.
• Coordinate R&D teams (Optical, Electrical, Mechanical, Firmware, Software) to achieve unified product goals.
• Lead detailed hardware design: schematic capture, circuit simulation, SI/PI analysis, layout collaboration, and mechanical integration (including fiber alignment).
• Oversee prototype bring-up, system-level troubleshooting, and validation testing.
• End-to-End Project Execution: Develop and drive project plans from concept to mass production.
• Foster innovation while ensuring on-time delivery of milestones.
• Implement robust product development lifecycle processes.
• Manage pilot builds and lead successful mass-production transfer.
• Manufacturing & Customer Enablement: Define ATE software requirements and manufacturing test/tuning algorithms.
• Provide technical support to customers and resolve complex field issues.

Experience

Bachelors degree in engineering or sciences with 12+ years of related experience, or Masters degree with 10+ years of related experience, or Ph.D. with 7 years of related experience.

Compensation and Benefits

The annual base salary range for this position is USD 143,800.00 To USD 230,000.00. As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.

Broadcom offers a competitive and comprehensive benefits package:

• Medical, dental and vision plans
• 401(K) participation including company matching
• Employee Stock Purchase Program (ESPP)
• Employee Assistance Program (EAP)
• company paid holidays
• paid sick leave
• vacation time

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law.

We will also consider qualified applicants with arrest and conviction records consistent with local law.

If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

Welcome! Thank you for your interest in Broadcom! We are a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions. For more information please visit our video library and check out our Connected by Broadcom series. Follow us on Linked In Broadcom Inc.