Opto-Mechanical Engineer - Thermal & Packaging Lead

Broadcom; Wayne (CA); On-site; USD 122,000 - 195,000; Full time

Benefits offered by this job

Discretionary annual bonus

Equity grants

401(K) matching

Employee Stock Purchase Program (ESPP)

Job summary

Broadcom is seeking a Mechanical Engineer with expertise in opto-electronic packaging or networking switch design to develop advanced optical systems and next‑gen silicon photonic engines. You will collaborate with optical, process, electronic, IC and application engineers to deliver robust mechanical solutions and contribute to fast-paced product development and division revenue.

Responsibilities include thermal simulations, tool-based modeling with Flotherm/Ansys, tolerance analysis, DFMEA and

Qualifications

• Bachelor's degree in Mechanical Engineering.
• 8+ years in opto-mechanical designs.
• Proficient in CAD (SolidWorks) and thermal/FEA tools.
• Excellent communication and cross-functional teamwork.

Responsibilities

• Perform thermal simulations to determine thermal resistances, power dissipation and mechanical stress over temperature.
• Use Flotherm and Ansys to simulate and optimize models of complex electronic assemblies under various conditions.
• Provide reports on simulation results and findings from failure analysis.
• Develop new products including concepts, design, drawings, vendor selection, part evaluation, and product builds.
• Generate designs and perform tolerance analysis of opto-mechanical structures.
• Perform failure analysis and design of experiments.
• Other activities include DFMEA, lab experimentation and dimensional metrology.

Skills

Opto-mechanical design

Mechanical design

Communication skills

Education

Bachelor's degree in Mechanical Engineering

Tools

SolidWorks

Flotherm

Ansys

Job description

Broadcom is seeking a Mechanical Engineer with expertise in opto-electronic packaging or networking switch design to develop advanced optical systems and next‑gen silicon photonic engines. You will collaborate with optical, process, electronic, IC and application engineers to deliver robust mechanical solutions and contribute to fast-paced product development and division revenue.

Responsibilities include thermal simulations, tool-based modeling with Flotherm/Ansys, tolerance analysis, DFMEA and