Hardware Engineer

Broadcom Inc.; San Jose (CA); On-site; USD 144,000 - 230,000; Full time

Benefits offered by this job

Medical, dental and vision

401(k) matching

ESPP

Employee Assistance Program (EAP)

Paid holidays

Paid time off

Job summary

Broadcom Inc. seeks a Technical Lead for Advanced Co-Packaged Optics (CPO) to drive end-to-end hardware development—from concept to mass production.

You will lead cross-functional teams spanning photonics, electronics, mechanical, firmware and software to meet aggressive performance, cost, and schedule goals. The role requires 12+ years in engineering or 10+ with a Master's (or 7+ with a PhD) and deep expertise in photonic/electronic IC design, optical engine packaging, and substrate/PCB

Qualifications

• Bachelor's degree in engineering or sciences with 12+ years of related experience, or Masters with 10+ years, or Ph.D. with 7 years of related experience.
• Experience leading end-to-end hardware development programs from concept to mass production.
• Strong expertise in integrated photonics, optics, and substrate/PCB integration.

Responsibilities

• Define CPO product architecture, subsystem interfaces, and critical design tradeoffs.
• Lead cross-functional teams to achieve unified product goals (Optical, Electrical, Mechanical, Firmware, Software).
• Oversee schematic capture, circuit simulation, SI/PI analysis, layout collaboration, and mechanical integration.

Skills

Cross-Functional Leadership

Photonic/Electronic IC design

Schematic capture & circuit simulation

Fiber alignment & optical packaging

Education

Bachelor's degree in engineering or sciences

Master's degree in related field

PhD in related field

Job description

## Hardware EngineerApply: USA-California-San Jose-1320 Ridder Park Drive: Full time: Posted Today: R027109**Please Note:****1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account)****2. If you already have a Candidate Account, please Sign-In before you apply.**## **Job Description:****Technical Lead - Advanced Co-Packaged Optics (CPO)***Lead the Innovation Frontier in Integrated Photonics & Electronics***Core Mission**Spearhead the end-to-end development of cutting-edge CPO products by leading a cross-functional R&D team. Drive architecture, design, validation, and production of integrated photonic/electronic systems to meet aggressive performance, cost, and timeline goals.**Key Responsibilities****Cross-Functional Team Leadership*** Define CPO product architecture, subsystem interfaces (Optical/Mechanical/Firmware/PCB), and critical design tradeoffs.* Champion design decisions balancing performance, manufacturability, and cost.* Provide expert guidance on photonic/electronic IC design, optical engine packaging, and substrate/PCB development.* Coordinate R&D teams (Optical, Electrical, Mechanical, Firmware, Software) to achieve unified product goals.* Lead detailed hardware design: schematic capture, circuit simulation, SI/PI analysis, layout collaboration, and mechanical integration (including fiber alignment).* Oversee prototype bring-up, system-level troubleshooting, and validation testing.**End-to-End Project Execution*** Develop and drive project plans from concept to mass production.* Foster innovation while ensuring on-time delivery of milestones.* Implement robust product development lifecycle processes.* Manage pilot builds and lead successful mass-production transfer.**Manufacturing & Customer Enablement*** Define ATE software requirements and manufacturing test/tuning algorithms.* Provide technical support to customers and resolve complex field issues.**Experience*** Bachelors degree in engineering or sciences with 12+ years of related experience, or Masters degree with 10+ years of related experience, or Ph.D. with 7 years of related experience **Compensation and Benefits** The annual base salary range for this position is USD 143,800.00 To USD 230,000.00 As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements. Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence. **Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.**