Lead Hardware Engineer – Advanced Co-Packaged Optics

Broadcom Inc.

San Jose (CA)

Hybrid

USD 144,000 - 230,000

Full time

12 days ago

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Benefits offered by this job

Medical, dental and vision

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ESPP

Employee Assistance Program (EAP)

Paid holidays

Paid time off

Job summary

Broadcom Inc. seeks a Technical Lead for Advanced Co-Packaged Optics (CPO) to drive end-to-end hardware development—from concept to mass production.

You will lead cross-functional teams spanning photonics, electronics, mechanical, firmware and software to meet aggressive performance, cost, and schedule goals. The role requires 12+ years in engineering or 10+ with a Master's (or 7+ with a PhD) and deep expertise in photonic/electronic IC design, optical engine packaging, and substrate/PCB

Qualifications

Bachelor's degree in engineering or sciences with 12+ years of related experience, or Masters with 10+ years, or Ph.D. with 7 years of related experience.
Experience leading end-to-end hardware development programs from concept to mass production.
Strong expertise in integrated photonics, optics, and substrate/PCB integration.

Responsibilities

Define CPO product architecture, subsystem interfaces, and critical design tradeoffs.
Lead cross-functional teams to achieve unified product goals (Optical, Electrical, Mechanical, Firmware, Software).
Oversee schematic capture, circuit simulation, SI/PI analysis, layout collaboration, and mechanical integration.