Staff Process Engineer, Advanced Packaging Innovation

Micron Technology, Inc; Boise, Northern (ID, KY); Hybrid; USD 110,000 - 140,000; Full time

Job summary

Micron Technology, Inc. seeks a Staff Process Engineer for the APTD Bonding team to start up, develop, and optimize bonding processes. You will improve product quality and reliability, drive yield and productivity, reduce cost, and manage risk while diagnosing and solving assembly issues.

You will apply DOE, SPC, FMEA and related methods, coordinate evaluations, and drive changes across process steps, tools, and materials for new product introductions.

Qualifications

• BS in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Chemistry, or Physics plus 5 years of relevant industry experience.
• Knowledge of Advanced Package Integration and DRAM, NAND, or other memory products.
• Experience with design of experiment techniques (DOE), Statistical Process Control (SPC), defect analysis and data analysis.
• Experience in semiconductor process engineering and packaging with fundamental understanding of incoming and outgoing process and equipment interactions.
• Ability to resolve sophisticated issues through root‑cause or model‑based problem solving and adjust to shifting responsibilities and needs of the team.

Responsibilities

• Develop new or modified process formulations, define equipment requirements and specifications, and review processing techniques and methods.
• Identify, diagnose, and resolve assembly process related problems.
• Coordinate and complete process, equipment, and material evaluation / optimization initiatives and implement changes at process step.
• Validate and fan out new process baseline qualified, including new process, tools, and/or materials for new product introduction.
• Support SPC/FDC/RMS/APC, and site-to-site portability.
• Audit material suppliers to achieve quality, cost and risk management objectives.

Skills

DOE

SPC

Defect analysis

Data analysis

Education

Bachelor's in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Chemistry, or Physics

MS or PhD in Materials Science, Chemical Engineering, Electrical Engineering, or Mechanical Engineering

Job description

Micron Technology, Inc. seeks a Staff Process Engineer for the APTD Bonding team to start up, develop, and optimize bonding processes. You will improve product quality and reliability, drive yield and productivity, reduce cost, and manage risk while diagnosing and solving assembly issues.

You will apply DOE, SPC, FMEA and related methods, coordinate evaluations, and drive changes across process steps, tools, and materials for new product introductions.