Junior Thermal Systems Engineer: Data Center Cooling & Modeling

Boyd; Town of Lancaster (NY); On-site; USD 65,000 - 95,000; Full time

Job summary

Boyd is seeking a Junior Thermal Research Engineer to support the design, modeling, and experimental validation of advanced thermal management systems for electronics cooling in data centers, semiconductor tests, and aerospace applications. You will work on liquid cooling, two-phase cooling, and heat exchanger architectures, applying thermal-fluid modeling tools to predict performance.

You will implement DOE studies, collect data, create CAD models and documentation, and collaborate with senior

Qualifications

• Bachelor's or Master's in Mechanical Engineering or related field.
• 0-2 years of relevant experience or thermal course work.
• ITAR US Person requirement as stated in posting.
• No relocation offered; candidates must reside within 60 miles of Lancaster PA.

Responsibilities

• Support design and development of thermal management systems, including liquid cooling, two-phase cooling, and heat exchanger architectures.
• Cooling system design including cold plates, CDUs and passive two-phase solutions.
• Develop and apply thermal-fluid modeling tools for system-level performance prediction.
• Implement and use machine learning, AI and data-driven methods.
• Assist in DOE design of experiments and data acquisition, validation of models.

Tools

Python

MATLAB

SolidWorks

Job description

Boyd is seeking a Junior Thermal Research Engineer to support the design, modeling, and experimental validation of advanced thermal management systems for electronics cooling in data centers, semiconductor tests, and aerospace applications. You will work on liquid cooling, two-phase cooling, and heat exchanger architectures, applying thermal-fluid modeling tools to predict performance.

You will implement DOE studies, collect data, create CAD models and documentation, and collaborate with senior