Junior Thermal Engineer: Electronics Cooling & Modeling

Boyd Thermal Solutions Inc.; Pennsylvania; On-site; USD 70,000 - 100,000; Full time

Job summary

Eaton in Lancaster, PA, seeks a Junior Thermal Research Engineer to support design, modeling and experimental validation of advanced thermal management systems for electronics cooling in data centers, semiconductors, and aerospace.

You will work on liquid and two-phase cooling, heat exchangers, and develop thermal-fluid models, apply ML/AI methods, support DOE and testbeds, and maintain CAD documents using SolidWorks.

Qualifications

• Bachelor's or Master's in Mechanical Engineering or related field.
• 0–2 years of relevant experience or thermal coursework.
• ITAR compliance and US person requirement.
• No relocation; candidates must reside within 60 miles of Lancaster, PA.

Responsibilities

• Support design, modeling, and experimental validation of thermal management systems.
• Develop and apply thermal-fluid modeling tools for system-level performance prediction.
• Implement machine learning, AI and data-driven methods.
• Support data center cooling system modeling at rack and component levels.
• Design of experiments (DOE) and support experimental testing, instrumentation, data acquisition.
• Create and maintain CAD models and engineering documentation (SolidWorks, P&IDs, drawings, test plans).
• Assist in development of Python/MATLAB simulation tools to aid engineering decisions.
• Support prototype development and testbed construction for cooling technologies.
• Collaborate with senior engineers to evaluate cooling technologies and design tradeoffs.

Skills

Thermal design

DOE

Python

MATLAB

CAD modeling

SolidWorks

Data analysis

Education

Bachelor's or Master's in Mechanical Engineering or related field

Academic focus in heat transfer, fluid dynamics, and thermal systems

Tools

SolidWorks

Python

MATLAB

Job description

Eaton in Lancaster, PA, seeks a Junior Thermal Research Engineer to support design, modeling and experimental validation of advanced thermal management systems for electronics cooling in data centers, semiconductors, and aerospace.

You will work on liquid and two-phase cooling, heat exchangers, and develop thermal-fluid models, apply ML/AI methods, support DOE and testbeds, and maintain CAD documents using SolidWorks.