Junior Thermal Engineer – Electronics Cooling

Boyd Thermal by Eaton

Lancaster (Lancaster County)

On-site

USD 70,000 - 95,000

Full time

14 days+

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Job summary

Boyd Thermal by Eaton in Lancaster, PA is seeking a Junior Thermal Research Engineer to support design, modeling, and experimental validation of advanced thermal management systems for high‑performance electronics cooling in data centers, semiconductors, and aerospace.

You will work on thermal-fluid system modeling, data-driven engineering, and product development to speed design cycles and improve system‑level insights, collaborating with a multidisciplinary team.

Qualifications

Bachelor’s degree in Mechanical Engineering or a related field is required or preferred.
Master’s or PhD degree in Mechanical Engineering or related field is preferred.
Experience with thermal-fluid modeling, experimentation, and DOE.
Familiarity with data center cooling or high-performance electronics thermal management is a plus.
Strong communication and collaboration skills.

Responsibilities

Support the design and development of thermal management systems including liquid cooling and heat exchanger architectures.
Perform thermal-fluid modeling for system-level performance prediction.
Contribute to experimental validation and DOE activities.
Develop and apply modeling tools using Python or MATLAB.
Collaborate with senior engineers to evaluate new cooling technologies.