Hybrid Intern: Advanced Packaging Integration & Simulation

Intel; Hillsboro (OR); Hybrid; USD 121,000 - 122,000; Full time

Benefits offered by this job

Hybrid work model

Stock bonuses

Health benefits

Retirement plans

Vacation

Job summary

Intel Technology Research in the United States seeks an Advanced Packaging Integration and Simulation Intern to collaborate with researchers and engineers on 2.5D/3D integration, wafer-level packaging, and chiplet architectures. You will develop package simulations, perform DOE studies, and assess mechanical and thermal performance.

This internship offers hands-on experience with cross-functional teams, model validation, and data-driven engineering analyses, with a hybrid work model and

Qualifications

• Candidate must pursue a PhD in a relevant STEM discipline.
• Availability for a full-time 3-month internship.

Responsibilities

• Support packaging integration across wafer-level and 2.5D/3D processes.
• Develop and execute DOE to study architecture, materials, and electrical/mechanical performance.
• Build, calibrate, and apply simulation models for package characteristics.
• Conduct thermo-mechanical simulations under temperature and loading conditions.
• Analyze data to identify root causes and suggest improvements.
• Collaborate with cross-functional teams to optimize yield, reliability, and manufacturability.
• Present findings through technical presentations or publications.

Skills

Laboratory experimentation

Engineering data analysis

Simulation/modeling workflows

Python

MATLAB

JMP

R

Statistical analysis

DOE

Machine learning for engineering

Education

PhD in Mechanical Engineering, Materials Science and Engineering, Electrical Engineering, Physics, Manufacturing Engineering

Tools

Python

MATLAB

JMP

R

Job description

Intel Technology Research in the United States seeks an Advanced Packaging Integration and Simulation Intern to collaborate with researchers and engineers on 2.5D/3D integration, wafer-level packaging, and chiplet architectures. You will develop package simulations, perform DOE studies, and assess mechanical and thermal performance.

This internship offers hands-on experience with cross-functional teams, model validation, and data-driven engineering analyses, with a hybrid work model and