Hybrid Internship: Advanced Packaging & Simulation

Intel

Phoenix (AZ)

Hybrid

USD 121,000 - 122,000

Full time

13 days ago
Application generator

Get a reply from this employer — a resume and cover letter tailored to exactly what they’re hiring for.

Get past ATS filters

Job summary

Intel Technology Research in the United States seeks an Advanced Packaging Integration and Simulation Intern to collaborate with researchers and engineers. You will develop package architectures, run simulations, and contribute to data analytics across process flows.

Ideal candidates are pursuing a PhD in a STEM field, can work full-time for three months, and bring experience in Python, MATLAB, DOE, and ML for engineering applications. The role offers a hybrid work model in the US.

Qualifications

  • Pursuing a PhD in a STEM discipline
  • Full-time internship for 3 months
  • 3+ months of lab, data analysis, or DOE experience
  • Programming or data analysis with Python, MATLAB, JMP, R, or similar tools
  • Statistical analysis, DOE, or ML for engineering applications
  • Exposure to advanced packaging or wafer-level packaging is a plus
  • Thermal/mechanical/electrical modeling or FEM preferred
  • Experience with failure analysis of semiconductor processes is a plus

Responsibilities

  • Support packaging integration activities across wafer-level and 2.5D/3D processes
  • Develop and run DOE to study architecture, process conditions, material behavior, and performance
  • Build, calibrate, and apply simulation models for mechanical and thermal behavior
  • Conduct thermo‑mechanical simulations under temperature, stress, and load conditions
  • Analyze inspection, process, and simulation data to identify root causes and improvements
  • Collaborate with cross‑functional teams to optimize yield, reliability and manufacturability
  • Present findings through technical presentations and potential publications

Skills

Lab experiments
Data analysis
DOE
Python
MATLAB
R
Machine learning

Education

PhD Mechanical Eng
PhD Materials Sci
PhD Electrical Eng
PhD Physics
PhD Manufacturing Eng

Tools

Python
MATLAB
JMP
R
FEM

Job description

Intel Technology Research in the United States seeks an Advanced Packaging Integration and Simulation Intern to collaborate with researchers and engineers. You will develop package architectures, run simulations, and contribute to data analytics across process flows.

Ideal candidates are pursuing a PhD in a STEM field, can work full-time for three months, and bring experience in Python, MATLAB, DOE, and ML for engineering applications. The role offers a hybrid work model in the US.

Get your free, confidential resume review.
or drag and drop your file here.
Similar jobs

Similar jobs worth comparing

Hybrid Intern: Advanced Packaging Integration & Simulation
Hybrid Intern: Advanced Packaging Integration & Simulation

Intel • Hillsboro (OR)

Hybrid
USD 121,000 - 122,000
Hybrid work model
Stock bonuses
Health benefits
+2
3D Packaging & Simulation Intern (Hybrid)
3D Packaging & Simulation Intern (Hybrid)

Intel Corporation • Phoenix (AZ), Northern (KY)

Hybrid
USD 121,000 - 122,000
Advanced Packaging Integration and Simulation Intern
Advanced Packaging Integration and Simulation Intern

Intel • Hillsboro (OR)

Hybrid
USD 121,000 - 122,000
Hybrid work model
Stock bonuses
Health benefits
+2
Advanced Packaging Integration and Simulation Intern
Advanced Packaging Integration and Simulation Intern

Intel • Phoenix (AZ)

On-site
USD 121,000 - 122,000
Advanced Packaging Integration and Simulation Intern
Advanced Packaging Integration and Simulation Intern

Intel Corporation • Phoenix (AZ), Northern (KY)

Hybrid
USD 121,000 - 122,000
Advanced Packaging Intern: 3D/2.5D Simulation & Yield
Advanced Packaging Intern: 3D/2.5D Simulation & Yield

Intel Corporation • Chandler (AZ)

Hybrid
USD 121,000 - 122,000
Hybrid Research Engineer Intern - STCO & 3D Packaging
Hybrid Research Engineer Intern - STCO & 3D Packaging

Intel • Austin (TX)

Hybrid
USD 142,000 - 143,000
Hybrid work model
Stock bonuses
Health benefits
Packaging Technology Development Graduate Intern
Packaging Technology Development Graduate Intern

Intel Corporation • Phoenix (AZ)

On-site
USD 121,000 - 122,000
Stock bonuses
Health insurance
Vacation
+1
Packaging Technology Development Graduate Intern
Packaging Technology Development Graduate Intern

Intel Corporation • Chandler (AZ)

On-site
USD 121,000 - 122,000
Stock bonuses
Health benefits
Retirement plan
+1
Semiconductor Packaging Research Engineer
Semiconductor Packaging Research Engineer

Intel Corporation • Phoenix (AZ), Northern (KY)

Hybrid
USD 122,000 - 232,000
Health benefits
Stock bonuses
Hybrid work model
+1