Process Engineer – Die to Wafer Hybrid Bonding

Applied Materials, Inc.; Santa Clara (CA); On-site; USD 147,000 - 202,500; Full time

Benefits offered by this job

Comprehensive benefits package

Bonus and stock award program

Career development opportunities

Job summary

A leading technology solutions provider in Santa Clara is seeking a Process Engineer to develop and optimize hybrid bonding processes for semiconductor manufacturing. The successful candidate will collaborate with top industry experts and utilize state-of-the-art equipment. The role requires a Master's or PhD in a relevant STEM field and offers a competitive salary ranging from $147,000 to $202,500, along with comprehensive benefits and opportunities for professional growth.

Qualifications

• In-depth knowledge of die-to-wafer bonding processes.
• Experience with plasma and wet clean systems.
• Understanding of bond interface physics.

Responsibilities

• Develop die-to-wafer hybrid bonding processes.
• Integrate D2W bonding with other process modules.
• Perform failure analysis and optimization.

Skills

Hands-on engineering experience

Process optimization

Statistical analysis

Problem-solving skills

Strong communication

Education

M.S. or Ph.D. in Materials Science, Electrical Engineering, Applied Physics

Tools

Statistical software (e.g., JMP)

Semiconductor manufacturing equipment

Job description

**Who We Are**Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world.**What We Offer**Salary:$147,000.00 - $202,500.00Location:Santa Clara,CAYou’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more.At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our .As a Process Engineer, you'll play a crucial role in designing and optimizing manufacturing processes for display and semiconductor manufacturing technologies. You will collect and analyze data, perform hardware characterization, and troubleshoot engineering issues. You'll also measure film properties, generate technical documentation, and engage with customers to resolve concerns. Process Engineers collaborate with vendors and suppliers, and become familiar with implementing new technologies and products. You will experiment, learn, and collaborate with some of the brightest minds in the semiconductor and display industries, partnering with our globally recognized R&D teams on state-of-the-art research and development projects. Join the Photonics Platforms Business Group within the CTO Office at Applied Materials’ Santa Clara headquarters, where you will work with a world‐class research team developing next‐generation optical interconnects technologies.We are seeking **hands‐on** Process Engineers to drive die‐to‐wafer (D2W) hybrid bonding R&D for silicon photonics and co‐packaged optics applications. This role focuses on hybrid bonding process development, pathfinding, technology de‐risking, and integration exploration.The engineer will develop and evaluate novel bonding flows enabling photonic–electronic co‐integration, a critical enabler for AI and HPC systems. The role provides on‐the‐job training and hands‐on experience with state‐of‐the‐art equipment, including the industry’s first fully integrated die‐to‐wafer hybrid bonding system.**Key Responsibilities*** Develop die‐to‐wafer hybrid bonding processes, including (but not limited to): + Surface preparation and plasma activation + High‐accuracy die placement and alignment + Post‐bond characterization and process evaluation* Integrate D2W bonding with adjacent process modules such as: + Dicing and die preparation + Die thinning + Inter‐die gap fill and planarization* Design and execute DOE‐driven experiments to understand process limits, sensitivities, and trade‐offs.* Own process optimization, perform failure analysis and characterization, and drive continuous engineering improvement.**Qualifications*** M.S. or Ph.D. in Materials Science, Electrical Engineering, Applied Physics, or a related STEM discipline.* In‐depth knowledge and hands‐on experience in one or more of the following: + Die‐to‐wafer or wafer‐to‐wafer bonding + Thin‐die handling and alignment‐critical processes + Direct process engineer experience on mainstream semiconductor equipment (plasma, wet clean, overlay/alignment, etc.) + 2.5D/3D integration* Strong understanding of: + Bond interface physics + Alignment and overlay fundamentals + Mechanical behavior of thin and fragile dies* Proficiency in statistical analysis and process control (e.g., DOE, SPC, JMP).* Self‐starter with strong problem‐solving skills; able to work both independently and collaboratively with minimal supervision.* Strong communication and interpersonal skills, with the ability to collaborate effectively across multidisciplinary teams.**Additional Information****Time Type:**Full time**Employee Type:**Assignee / Regular**Travel:**Yes, 10% of the Time**Relocation Eligible:**YesThe salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable.For all sales roles, the posted salary range is the Target Total Cash (TTC) range for the role, which is the sum of base salary and target bonus amount at 100% goal achievement.Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.In addition, Applied endeavors to make our accessible to all users. If you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at Accommodations\[e-mail], or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. This contact is for accommodation requests only and cannot be used to inquire about the status of applications.