Die-to-Wafer Hybrid Bonding Process Engineer

Applied Materials, Inc.; Santa Clara (CA); On-site; USD 147,000 - 202,500; Full time

Benefits offered by this job

Comprehensive benefits package

Bonus and stock award program

Career development opportunities

Job summary

A leading technology solutions provider in Santa Clara is seeking a Process Engineer to develop and optimize hybrid bonding processes for semiconductor manufacturing. The successful candidate will collaborate with top industry experts and utilize state-of-the-art equipment. The role requires a Master's or PhD in a relevant STEM field and offers a competitive salary ranging from $147,000 to $202,500, along with comprehensive benefits and opportunities for professional growth.

Qualifications

• In-depth knowledge of die-to-wafer bonding processes.
• Experience with plasma and wet clean systems.
• Understanding of bond interface physics.

Responsibilities

• Develop die-to-wafer hybrid bonding processes.
• Integrate D2W bonding with other process modules.
• Perform failure analysis and optimization.

Skills

Hands-on engineering experience

Process optimization

Statistical analysis

Problem-solving skills

Strong communication

Education

M.S. or Ph.D. in Materials Science, Electrical Engineering, Applied Physics

Tools

Statistical software (e.g., JMP)

Semiconductor manufacturing equipment

Job description

A leading technology solutions provider in Santa Clara is seeking a Process Engineer to develop and optimize hybrid bonding processes for semiconductor manufacturing. The successful candidate will collaborate with top industry experts and utilize state-of-the-art equipment. The role requires a Master's or PhD in a relevant STEM field and offers a competitive salary ranging from $147,000 to $202,500, along with comprehensive benefits and opportunities for professional growth.