High-Speed FPGA Packaging Engineer

Socket.dev; San Jose (CA); On-site; USD 140,000 - 190,000; Full time

Job summary

AMD's Adaptive and Embedded Computing Group seeks an experienced package design engineer to define cost-effective, high-performance package solutions for FPGA devices, collaborating across silicon, firmware, and software teams.

You will work on multiple package families, translate electrical requirements into manufacturable package technologies, and communicate with design centers to drive projects from start to sign-off. Location: San Jose, CA.

Qualifications

• Experience with embedded/package design for FPGA devices.
• Knowledge of DoE, DFM/DFR is a plus.
• Excellent communication across design centers and teams.

Responsibilities

• Use Cadence tools for design, modeling and simulations. Enable timely closure of designs by collaborating with chip/system teams to sign off.
• Define package requirements (technology, stack-up) and negotiate with chip/system teams on product specs.
• Conduct routing, stack-up & component placement studies and translate requirements for various device packaging.
• Collaborate with PCB Layout Engineers to optimize the package ballmap and die size.
• Develop multi-signal package models over 50 GHz bandwidth and test structures for model-to-measurement correlation.
• Create performance metrics for organic package technologies to design high-speed chips and systems.
• Perform Power Integrity analysis for core and IO and specify PDN requirements.
• Develop scripts to check package parameters across device families and maintain electrical guidelines.

Skills

Cadence tools

Power Integrity

SerDes design

2D/3D package design

Mentor junior designers

Education

Bachelor’s or Master’s degree in Engineering

Tools

Cadence package design tool

Ansys

AutoCAD

Job description

AMD's Adaptive and Embedded Computing Group seeks an experienced package design engineer to define cost-effective, high-performance package solutions for FPGA devices, collaborating across silicon, firmware, and software teams.

You will work on multiple package families, translate electrical requirements into manufacturable package technologies, and communicate with design centers to drive projects from start to sign-off. Location: San Jose, CA.