Head of Thermal-Mechanical Reliability for AI-Driven HPC
Flexcompute
Watertown (MA)
On-site
USD 150,000 - 200,000
Full time
14 days+
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Benefits offered by this job
Competitive compensation with equity
Medical, dental, and vision health insurance
401(k) contribution
Gym allowance
Friendly and intelligent coworkers
Job summary
A leading technology firm in Watertown is seeking a visionary technical leader to head a division focused on 3D-IC Thermal-Mechanical Reliability. The role involves owning the technical roadmap, designing advanced simulation workflows, and collaborating with elite semiconductor companies. Candidates should have a PhD and over 10 years of experience in the semiconductor industry. Benefits include competitive compensation, health insurance, a 401(k) contribution, and a gym allowance.
Qualifications
Deep specialization in computational multi-physics.
Recognized expertise in mechanics of warpage and thermal-mechanical coupling.
10+ years of experience in semiconductor or microelectronics industry.
Responsibilities
Own the technical roadmap for the thermal-mechanical domain.
Design simulation workflows for 3D-IC challenges.
Collaborate with semiconductor companies to demonstrate GPU speed.
Recruit and lead a high-performing engineering team.
Skills
3D-IC reliability knowledge
Experience in GPU acceleration
Leadership in technical projects
Understanding of thermal-mechanical coupling
Education
PhD in Mechanical Engineering, Materials Science, Physics
Job description
A leading technology firm in Watertown is seeking a visionary technical leader to head a division focused on 3D-IC Thermal-Mechanical Reliability. The role involves owning the technical roadmap, designing advanced simulation workflows, and collaborating with elite semiconductor companies. Candidates should have a PhD and over 10 years of experience in the semiconductor industry. Benefits include competitive compensation, health insurance, a 401(k) contribution, and a gym allowance.