Lead Architect, Physics AI for 3D-IC Thermal Reliability
Flexcompute, inc.
14 days+
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Benefits offered by this job
Job summary
A leading technology firm is seeking a visionary technical leader to head their new division focused on 3D-IC Thermal-Mechanical Reliability. This role will involve owning the technical roadmap and leading innovative simulation workflows to address critical challenges in the semiconductor industry. The ideal candidate will possess a PhD in Mechanical Engineering or a related field, with over 10 years of industry experience in 3D-IC reliability. Competitive compensation and benefits are offered at this fast-growing startup.
Qualifications
- Recognized expertise in 3D-IC reliability and thermal-mechanical coupling.
- 10+ years experience in semiconductor or microelectronics industry.
- Proven project leadership in technical environments.
Responsibilities
- Own technical roadmap for thermal-mechanical domain.
- Design simulation workflows for 3D-IC challenges.
- Lead technical partnerships with semiconductor companies.
- Influence development of GPU-accelerated solvers.
- Recruit and mentor a high-performing engineering team.
Skills
3D-IC reliability expertise
Gpu acceleration perspective
Leadership skills
Strong communication skills
Education
PhD in Mechanical Engineering
Job description
A leading technology firm is seeking a visionary technical leader to head their new division focused on 3D-IC Thermal-Mechanical Reliability. This role will involve owning the technical roadmap and leading innovative simulation workflows to address critical challenges in the semiconductor industry. The ideal candidate will possess a PhD in Mechanical Engineering or a related field, with over 10 years of industry experience in 3D-IC reliability. Competitive compensation and benefits are offered at this fast-growing startup.
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