Physics AI - Thermal-Mechanical Reliability

Flexcompute; Watertown (MA); On-site; USD 150,000 - 200,000; Full time

Benefits offered by this job

Competitive compensation with equity

Medical, dental, and vision health insurance

401(k) contribution

Gym allowance

Friendly and intelligent coworkers

Job summary

A leading technology firm in Watertown is seeking a visionary technical leader to head a division focused on 3D-IC Thermal-Mechanical Reliability. The role involves owning the technical roadmap, designing advanced simulation workflows, and collaborating with elite semiconductor companies. Candidates should have a PhD and over 10 years of experience in the semiconductor industry. Benefits include competitive compensation, health insurance, a 401(k) contribution, and a gym allowance.

Qualifications

• Deep specialization in computational multi-physics.
• Recognized expertise in mechanics of warpage and thermal-mechanical coupling.
• 10+ years of experience in semiconductor or microelectronics industry.

Responsibilities

• Own the technical roadmap for the thermal-mechanical domain.
• Design simulation workflows for 3D-IC challenges.
• Collaborate with semiconductor companies to demonstrate GPU speed.
• Directly influence GPU-accelerated solver development.
• Recruit and lead a high-performing engineering team.

Skills

3D-IC reliability knowledge

Experience in GPU acceleration

Leadership in technical projects

Understanding of thermal-mechanical coupling

Education

PhD in Mechanical Engineering, Materials Science, Physics

Job description

Flexcompute is the physics company. We bridge first‑principles physics and neural foundation models to redefine the boundaries of industrial simulation and design. We believe that the next era of engineering will be defined by the convergence of massive parallel computing and artificial intelligence.

Our core technology features the world’s fastest GPU solvers, capable of delivering orders‑of‑magnitude speedups over traditional tools. By integrating these solvers with our Physics AI Foundation Models, we enable engineers to explore design spaces that were previously computationally inaccessible. At Flexcompute, we don’t just make simulations faster; we make the “impossible” solvable, helping our partners tackle the most critical challenges in 3D‑IC design, aerospace, and beyond.

Role Overview

Flexcompute is seeking a visionary technical leader to head our new division focused on 3D‑IC Thermal‑Mechanical Reliability. In this role, you will be the primary architect of how we apply our world’s fastest GPU solvers and Physics AI Foundation Models to the semiconductor industry’s most critical bottleneck: the structural and thermal integrity of advanced packaging. You will lead the strategy for solving high‑stakes issues such as warpage, CTE mismatch, and thermal‑induced stress in 3D‑ICs and chiplet architectures, and you will define the future of how AI and high‑performance computing (HPC) converge to make 3D chips viable at scale.

Qualifications

• Education: PhD in Mechanical Engineering, Materials Science, Physics, or a related field with a deep specialization in computational multi‑physics.
• Subject Matter Authority: Recognized expertise in 3D‑IC reliability, with a profound understanding of the mechanics of warpage, interfacial delamination, and thermal‑mechanical coupling in heterogeneous integration.
• AI/Simulation Fluent: A strong perspective on the role of GPU acceleration and Machine Learning in scientific computing.
• Industry Track Record: 10+ years of experience in the semiconductor or microelectronics industry, having led technical projects that directly impacted product reliability or time‑to‑market.

Responsibilities

• Strategic Leadership: Own the technical roadmap for the thermal‑mechanical domain and define how our Physics AI accelerates traditional FEA/multi‑physics workflows to provide real‑time reliability insights.
• Architectural Innovation: Design end‑to‑end simulation workflows that address complex 3D‑IC challenges, including through‑silicon via (TSV) stress, micro‑bump reliability, and global package warpage.
• High‑Stakes Collaboration: Act as the lead technical partner for world‑class semiconductor companies, demonstrating how Flexcompute’s speed transforms their iterative design cycles from days to minutes.
• Product Influence: Directly influence the development of our GPU‑accelerated solvers, ensuring they are optimized for the non‑linear material behaviors and multi‑scale meshes required for advanced packaging.
• Team Building: Recruit, mentor, and lead a high‑performing team of engineers specialized in computational mechanics and AI‑driven physics.

Benefits

• Competitive compensation with equity of a fast‑growing startup.
• Medical, dental, and vision health insurance.
• 401(k) contribution.
• Gym allowance.
• Friendly, thoughtful, and intelligent coworkers.