Senior Mechanical & Thermal Lead for AI-Compute Hardware

Micron Technology; Boise (ID); On-site; USD 110,000 - 160,000; Full time

Benefits offered by this job

Medical, dental, vision plans

Paid time off

Paid holidays

Benefits guide

Job summary

Micron Technology, a world leader in memory and storage solutions, seeks a seasoned Mechanical & Thermal Engineer to shape the mechanical and thermal architecture of next‑gen hardware platforms. Bring 7+ years of experience in electronics/semiconductor environments and lead cross‑functional teams to deliver heat‑mitigated, reliable products through concept to high‑volume manufacturing.

You will perform thermal CFD/FEA analyses, develop cooling strategies, and drive validation plans across

Qualifications

• Bachelor’s or Master’s degree in Mechanical Engineering required.
• 7+ years in mechanical and thermal engineering in electronics/semiconductor.
• Strong SolidWorks, CFD and thermal modeling skills.
• Experience delivering from concept to high-volume manufacturing.
• Ability to lead cross-functional teams.

Responsibilities

• Design, develop, test, validate, and release mechanical and thermal solutions for advanced electronic systems.
• Develop innovative cooling solutions including heat spreaders, heatsinks, vapor chambers.
• Define mechanical, thermal, reliability, and manufacturability requirements to meet objectives.
• Perform thermal CFD and mechanical FEA analyses to optimize design.
• Develop validation strategies including thermal characterization, vibration testing, DFMEA.
• Lead design reviews and corrective actions throughout the product lifecycle.
• Collaborate with cross-functional teams to deliver optimized, manufacturable solutions.
• Mentor engineers and champion AI-enabled engineering workflows.

Skills

Thermal engineering

Mechanical engineering

Problem solving

Education

Bachelor’s or Master’s degree in Mechanical Engineering

Tools

SolidWorks

ANSYS Icepak

Fluent

Job description

Micron Technology, a world leader in memory and storage solutions, seeks a seasoned Mechanical & Thermal Engineer to shape the mechanical and thermal architecture of next‑gen hardware platforms. Bring 7+ years of experience in electronics/semiconductor environments and lead cross‑functional teams to deliver heat‑mitigated, reliable products through concept to high‑volume manufacturing.

You will perform thermal CFD/FEA analyses, develop cooling strategies, and drive validation plans across