Head of Defect Modeling & Testing (2D/3D Packaging)

TSMC - Taiwan Semiconductor Manufacturing Company Limited; San Jose (CA); Presencial; USD 153.000 - 244.000; Jornada completa

Descripción de la vacante

TSMC - Taiwan Semiconductor Manufacturing Company Limited is seeking an experienced Technical Manager to lead advanced defect modeling and testing for next‑gen 2.5D/3D packaging in San Jose, CA. You will build models, run SPICE simulations, and guide cross‑functional teams across design, process, and reliability.

The role demands 15+ years in defect physics and reliability for semiconductor devices, with strong scripting (Python/Perl/C++) and ATPG skills.

Formación

• Master’s or Ph.D. in Computer Engineering, Semiconductor Physics, or related field.
• 15+ years of experience in failure mechanisms, defect physics, testing, or reliability analyses for semiconductor devices.
• Proficiency with SPICE tools, LVS/DRC, and ATPG for packaging/advanced nodes; programming in Python, Perl, C++.
• Familiarity with AI/ML for defect prediction is a plus.
• Contributions through patents/publications in defect modeling or advanced packaging.

Responsabilidades

• Develop defect models for 2D and 3D structures and perform root-cause analyses of defects.
• Run SPICE simulations and generate defect-oriented test patterns using ATPG tools.
• Design and optimize test structures and collaborate with cross functional teams.
• Advance research methodologies and contribute to patents and publications.
• Balance fundamental research with collaboration across design, process, and manufacturing teams.

Conocimientos

Defect modeling

Cross-functional collaboration

Research & development

Failure mechanisms

3D packaging knowledge

Educación

Master’s or Ph.D. in Computer Engineering, Semiconductor Physics, or related field

Herramientas

SPICE simulation tools

LVS/DRC verification

DFT/ATPG for packaging

Python

Perl

C++

Descripción del empleo

TSMC - Taiwan Semiconductor Manufacturing Company Limited is seeking an experienced Technical Manager to lead advanced defect modeling and testing for next‑gen 2.5D/3D packaging in San Jose, CA. You will build models, run SPICE simulations, and guide cross‑functional teams across design, process, and reliability.

The role demands 15+ years in defect physics and reliability for semiconductor devices, with strong scripting (Python/Perl/C++) and ATPG skills.