Account & Technical Manager — 2.5D/3D Packaging

TSMC - Taiwan Semiconductor Manufacturing Company Limited

California

Hybrid

USD 132,000 - 187,000

Full time

2 days ago
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Job summary

TSMC North America seeks an Account Manager / Technical Manager based in San Jose, CA to own the technical account relationship for one of TSMC’s key global customers serving data center, networking, broadband, and industrial markets. You will interface with the customer’s technical and procurement teams, driving front-end silicon technology and backend packaging programs (2.5D/3D).

The role requires fluency in semiconductor design, strong commercial acumen, and high emotional intelligence to

Qualifications

  • Bachelor or Master in engineering, physical science, or business.
  • 12+ years in account management, applications/field engineering, tech PM, or foundry/oem supply chain.
  • Strong knowledge of semiconductor processes, fab operations, and supply chain dynamics.

Responsibilities

  • Own the account relationship as primary TSMC interface and sustain executive-level alignment.
  • Manage front-end silicon and advanced packaging programs — 2.5D/3D packaging — from planning through ramp.
  • Translate customer requirements into programs with R&D, Planning, FTS, BD, Operations, and Finance, coordinating with TSMC HQ in Taiwan.
  • Anticipate and address customer challenges, balancing objectives.
  • Manage capacity and fulfillment cycles with procurement, design, and business units to ensure demand creation and supply alignment.
  • Provide structured business analysis and briefings for Account Directors, VPs, and senior executives.

Skills

Executive communication
Project management
Excel proficiency
Semiconductor knowledge

Education

BS/MS in Engineering, Physical Science, or Business

Tools

Microsoft Excel

Job description

TSMC North America seeks an Account Manager / Technical Manager based in San Jose, CA to own the technical account relationship for one of TSMC’s key global customers serving data center, networking, broadband, and industrial markets. You will interface with the customer’s technical and procurement teams, driving front-end silicon technology and backend packaging programs (2.5D/3D).

The role requires fluency in semiconductor design, strong commercial acumen, and high emotional intelligence to

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