HBM Memory Architect – AI‑Driven High‑Speed Design (Equity)

1000 Micron Technology, Inc.; Richardson (TX); On-site; USD 97,000 - 205,000; Full time

Job summary

Micron Technology, Inc. is seeking an HBM Memory Design Architect to design and analyze digital and analog circuits used in memory products, including DRAM and HBM. You will simulate, optimize, and floor plan circuits while evaluating full chip functionality.

Join a highly innovative team and contribute to new HBM product opportunities, perform technical feasibility analyses, and collaborate on layout and optimization of memory, logic, and analog circuits.

Qualifications

• CMOS circuit design and device physics expertise.
• Schematic entry and simulation using FineSim and/or HSPice.
• DRAM product design/verification experience (DDR, LPDDR, HBM, CIM) is a plus.
• Strong problem-solving and analytical skills.
• Good communication and teamwork.

Responsibilities

• Design and analyze digital and analog circuits for memory products.
• Simulate, optimize, and floor plan DRAM circuits.
• Evaluate full-chip or block-level functionality.
• Explore new architectures for future HBM products; perform feasibility analyses.
• Contribute to development and optimization of Memory, Logic, and Analog circuits.
• Conduct research leveraging AI.

Skills

CMOS circuit design

Device physics

Schematic & simulation tools

DRAM design experience

Education

NCG Ph.D or NCG Master

Tools

FineSim

HSPice

Job description

Micron Technology, Inc. is seeking an HBM Memory Design Architect to design and analyze digital and analog circuits used in memory products, including DRAM and HBM. You will simulate, optimize, and floor plan circuits while evaluating full chip functionality.

Join a highly innovative team and contribute to new HBM product opportunities, perform technical feasibility analyses, and collaborate on layout and optimization of memory, logic, and analog circuits.