HBM Design Architect – AI‑Driven Memory for AI & HPC

1000 Micron Technology, Inc.; Richardson (TX); On-site; USD 120,000 - 180,000; Full time

Benefits offered by this job

Benefits package

Paid time off

Retirement plan

Job summary

Micron Technology, Inc. seeks a New College Graduate HBM Design Architect to contribute to evaluating future HBM/DRAM architectures. You will work with experienced teams to analyze performance, power, area, and reliability, using AI-assisted methods to speed architecture exploration.

Responsibilities include modeling, simulations, and data analysis, plus cross-team collaboration to assess design feasibility and manufacturability. Strong foundation in memory and CMOS topics is essential.

Qualifications

• Master's or Ph.D. completed before start date.
• Strong foundation in CMOS, memory systems, or digital/mixed-signal design.
• Experience with models, simulations, or analytical methods.
• Ability to evaluate problems and communicate results effectively.
• Excellent written and verbal communication skills.

Responsibilities

• Analyze HBM and DRAM architectures using models, simulations, and data.
• Develop and apply modeling, simulation, and data-analysis methodologies.
• Collaborate with architecture, circuit, layout, and product teams on feasibility and tradeoffs.
• Perform root-cause analysis to improve model accuracy.
• Present findings and recommendations through reviews and documentation.

Skills

CMOS circuits

digital/mixed-signal design

memory systems

signal integrity

AI in engineering

Education

Master's or Ph.D. in Electrical Engineering or Computer Engineering

Tools

HSPICE

FineSim

Spectre

Job description

Micron Technology, Inc. seeks a New College Graduate HBM Design Architect to contribute to evaluating future HBM/DRAM architectures. You will work with experienced teams to analyze performance, power, area, and reliability, using AI-assisted methods to speed architecture exploration.

Responsibilities include modeling, simulations, and data analysis, plus cross-team collaboration to assess design feasibility and manufacturability. Strong foundation in memory and CMOS topics is essential.