HBM Design Architect - New Grad (AI-Driven)

Micron Technology, Inc; Richardson (TX); On-site; USD 90,000 - 130,000; Full time

Benefits offered by this job

Medical, dental and vision plans

Paid time off

Paid holidays

Job summary

Micron Technology, Inc. in Richardson, TX is seeking a New College Graduate to join the HBM Architecture team as an HBM Design Architect. You will work with experienced engineers to evaluate future HBM/DRAM architectures, using analytical models, simulations, silicon data, and AI-assisted techniques to optimize performance, power, and reliability.

Relocation Level: TBD. The role emphasizes collaboration across architecture, design, verification, packaging, and product teams to accelerate

Qualifications

• Master's or Ph.D. degree in Electrical Engineering, Computer Engineering, or a related field completed prior to start date.
• Strong foundation in CMOS circuits, digital or mixed-signal design, semiconductor devices, memory systems, or related areas.
• Experience developing engineering models, simulations, or analytical methodologies during graduate research or coursework.

Responsibilities

• Analyze HBM and DRAM architectures using models, simulations, silicon data, and AI-assisted techniques.
• Develop and apply modeling and data-analysis methodologies for architectural exploration.
• Collaborate with architecture, circuit design, layout, packaging, product, and system teams to evaluate feasibility and tradeoffs.
• Perform root-cause analysis using simulation and data to improve model accuracy and recommendations.
• Communicate technical findings through presentations and documentation.

Skills

CMOS circuits

digital design

memory systems

signal integrity

power delivery

thermal sciences

architecture with AI/LLMs

Education

Master's or Ph.D. in Electrical Engineering or Computer Engineering

Tools

HSPICE

Spectre

FineSim

Job description

Micron Technology, Inc. in Richardson, TX is seeking a New College Graduate to join the HBM Architecture team as an HBM Design Architect. You will work with experienced engineers to evaluate future HBM/DRAM architectures, using analytical models, simulations, silicon data, and AI-assisted techniques to optimize performance, power, and reliability.

Relocation Level: TBD. The role emphasizes collaboration across architecture, design, verification, packaging, and product teams to accelerate