HBM Architecture Intern: Pioneering High-Bandwidth Memory

Micron Technology, Inc; Richardson (TX); On-site; USD 35,818,000 - 44,083,000; Full time

Benefits offered by this job

Medical, dental and vision plans

Paid time off

Paid holidays

Job summary

Micron Technology, Inc. is seeking an HBM Design Architect Intern to evaluate HBM and DRAM concepts, build analytical models, and study performance, power, and reliability tradeoffs. You will leverage AI-assisted engineering workflows to support design exploration and productivity during this internship.

You will collaborate with architecture, circuit, verification, layout, packaging, product, and system teams to assess feasibility and drive future technology decisions.

Qualifications

• Pursuing a Master's or Ph.D. in Electrical or Computer Engineering or related field and returning to the degree after internship.
• Strong foundation in at least two areas: CMOS, digital/mixed-signal design, devices, computer architecture, memory systems, thermal sciences, power delivery, signal integrity, or advanced packaging.
• Experience using engineering analysis, modeling, or simulation tools via research, coursework, labs, or internships.
• Ability to define assumptions, perform technical analysis, evaluate results, and communicate conclusions.
• Strong problem-solving, analytical, and communication skills.

Responsibilities

• Analyze HBM and DRAM architecture tradeoffs for timing, bandwidth, power, area, thermal performance, reliability, and design complexity using analytical, simulation, and AI-assisted methods.
• Develop first-order models, simulations, and data-analysis tools to compare design options and support pathfinding studies.
• Collaborate with architecture, circuit, verification, layout, packaging, product, and system teams to evaluate feasibility and tradeoffs.
• Review simulation, experimental, and silicon data to perform root-cause analysis and improve model accuracy.
• Apply LLMs, Generative AI, and AI-assisted workflows to enhance analysis and productivity while documenting findings to multi-functional teams.

Skills

Problem-solving

Analytical thinking

Verbal communication

Written communication

Education

Master's or PhD in Electrical/Computer Engineering

Return to degree program after internship

Tools

HSPICE

FineSim

Spectre

Job description

Micron Technology, Inc. is seeking an HBM Design Architect Intern to evaluate HBM and DRAM concepts, build analytical models, and study performance, power, and reliability tradeoffs. You will leverage AI-assisted engineering workflows to support design exploration and productivity during this internship.

You will collaborate with architecture, circuit, verification, layout, packaging, product, and system teams to assess feasibility and drive future technology decisions.