HBM Architecture Engineer - New Grad (AI-Driven Design)

Micron; Richardson (TX); On-site; USD 90,000 - 130,000; Full time

Benefits offered by this job

Medical/dental/vision plans

Paid time off

Paid holidays

Benefits overview

Job summary

Micron Technology is seeking a New College Graduate to join the HBM Architecture team as an HBM Design Architect. You will evaluate future HBM/DRAM architectures, analyze tradeoffs, and work with teams across architecture, design, and packaging to drive scalable, high-performance memory solutions.

You will apply AI, LLMs, and data-driven approaches to accelerate exploration, with a strong emphasis on timing, power, area, and manufacturability considerations. A Master’s or PhD is preferred.

Qualifications

• Master's or Ph.D. degree in Electrical or Computer Engineering completed prior to start date.
• Strong foundation in CMOS, digital/mixed-signal design, memory systems, power delivery, signal integrity, thermal sciences or advanced packaging.
• Experience developing engineering models, simulations, or analytical methodologies.
• Ability to evaluate complex problems and communicate recommendations to multidisciplinary teams.
• Excellent written and verbal communication skills.

Responsibilities

• Analyze HBM and DRAM architectures using models, simulations, silicon data, and AI-assisted techniques.
• Develop modeling and data-analysis methods to assess architectural approaches.
• Collaborate with multiple teams to evaluate feasibility, performance tradeoffs, and manufacturability.
• Perform root-cause analysis to improve model accuracy and provide evidence-based recommendations.
• Communicate technical findings through presentations and design reviews.

Skills

CMOS circuits

Digital/mixed-signal design

Memory systems

Power delivery

Signal integrity

Thermal sciences

Advanced packaging

Education

Master's or PhD in Electrical Engineering or Computer Engineering

Tools

HSPICE

FineSim

Spectre

Job description

Micron Technology is seeking a New College Graduate to join the HBM Architecture team as an HBM Design Architect. You will evaluate future HBM/DRAM architectures, analyze tradeoffs, and work with teams across architecture, design, and packaging to drive scalable, high-performance memory solutions.

You will apply AI, LLMs, and data-driven approaches to accelerate exploration, with a strong emphasis on timing, power, area, and manufacturability considerations. A Master’s or PhD is preferred.