New College Grad - HBM Design Architect | MS or PhD

Micron; Richardson (TX); On-site; USD 90,000 - 130,000; Full time

Benefits offered by this job

Medical/dental/vision plans

Paid time off

Paid holidays

Benefits overview

Job summary

Micron Technology is seeking a New College Graduate to join the HBM Architecture team as an HBM Design Architect. You will evaluate future HBM/DRAM architectures, analyze tradeoffs, and work with teams across architecture, design, and packaging to drive scalable, high-performance memory solutions.

You will apply AI, LLMs, and data-driven approaches to accelerate exploration, with a strong emphasis on timing, power, area, and manufacturability considerations. A Master’s or PhD is preferred.

Qualifications

• Master's or Ph.D. degree in Electrical or Computer Engineering completed prior to start date.
• Strong foundation in CMOS, digital/mixed-signal design, memory systems, power delivery, signal integrity, thermal sciences or advanced packaging.
• Experience developing engineering models, simulations, or analytical methodologies.
• Ability to evaluate complex problems and communicate recommendations to multidisciplinary teams.
• Excellent written and verbal communication skills.

Responsibilities

• Analyze HBM and DRAM architectures using models, simulations, silicon data, and AI-assisted techniques.
• Develop modeling and data-analysis methods to assess architectural approaches.
• Collaborate with multiple teams to evaluate feasibility, performance tradeoffs, and manufacturability.
• Perform root-cause analysis to improve model accuracy and provide evidence-based recommendations.
• Communicate technical findings through presentations and design reviews.

Skills

CMOS circuits

Digital/mixed-signal design

Memory systems

Power delivery

Signal integrity

Thermal sciences

Advanced packaging

Education

Master's or PhD in Electrical Engineering or Computer Engineering

Tools

HSPICE

FineSim

Spectre

Job description

About the Team

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron Technology, we transform how the world uses information to enrich life for all. The Heterogeneous Integration Group (HIG) HBM Architecture team develops next-generation High-Bandwidth Memory (HBM) solutions that power AI, high-performance computing, cloud infrastructure, and advanced networking systems. The team works across architecture, design, verification, packaging, product engineering, and technology development to evaluate innovative memory architectures and deliver scalable, high-performance semiconductor solutions.

Position Overview

As an HBM Design Architect, New College Graduate, you will contribute to the evaluation and development of future HBM and DRAM architectures. Working with experienced architects and engineering teams, you will analyze system and block-level design tradeoffs related to performance, power, area, thermal behavior, reliability, and manufacturability. This role provides an opportunity to leverage AI, Large Language Models (LLMs), and data-driven engineering methodologies to accelerate architecture exploration and improve decision-making.

Responsibilities

Analyze HBM and DRAM architectures using analytical models, simulations, silicon data, and AI-assisted techniques to evaluate timing, bandwidth, power, area, thermal performance, reliability, and design complexity.

Develop and apply modeling, simulation, and data-analysis methodologies to assess alternative architectural approaches, identify design sensitivities, and support technology pathfinding.

Collaborate with architecture, circuit design, layout, packaging, product, and system teams to evaluate implementation feasibility, performance tradeoffs, signal integrity, power delivery, and manufacturability considerations.

Perform root-cause analysis using simulation and measured data to improve model accuracy, validate assumptions, and provide evidence-based design recommendations.

Communicate technical findings through presentations, design reviews, architecture discussions, and written documentation, clearly articulating assumptions, risks, and recommended actions.

Minimum Qualifications

Master's or Ph.D. degree in Electrical Engineering, Computer Engineering, or a related field completed prior to the employment start date.

Strong foundation in at least two of the following areas: CMOS circuits, digital or mixed-signal design, semiconductor devices, computer architecture, memory systems, thermal sciences, signal integrity, power delivery, or advanced packaging.

Experience developing engineering models, simulations, or analytical methodologies through graduate research, coursework, internships, or laboratory projects.

Demonstrated ability to evaluate complex technical problems, draw evidence-based conclusions, and communicate recommendations effectively to multidisciplinary teams.

Strong analytical, problem-solving, written communication, and verbal communication skills.

Preferred Qualifications

Graduate research, internship, thesis, dissertation, or project experience related to HBM, DRAM, SRAM, memory controllers, high-speed interfaces, semiconductor architecture, or 3D integration technologies.

Experience with engineering simulation and analysis tools such as HSPICE, FineSim, Spectre, or similar circuit-design environments.

Understanding of power, performance, area, timing, thermal, and reliability tradeoffs in advanced semiconductor designs.

Experience using data analytics, AI, Large Language Models (LLMs), or Generative AI technologies to enhance engineering productivity, design exploration, or technical analysis.

Technical communication experience demonstrated through publications, conference presentations, patents, research reviews, or design reports.

Micron Benefits

We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

Equal Opportunity Employment

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

Compliance Statement

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards. Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.