HBM Design Architect Intern (AI‑Assisted)

Micron; Richardson (TX); On-site; USD 34,000 - 48,000; Part time

Benefits offered by this job

Medical, dental and vision plans

Paid time off

Paid holidays

Job summary

Micron Technology is seeking an HBM Design Architect Intern in Richardson, TX. You will work with experienced architects to evaluate HBM/DRAM concepts, develop analytical models, and explore design tradeoffs affecting performance, power, and reliability.

The role leverages AI-assisted engineering workflows and LLMs for design exploration. You will collaborate across architecture, design, verification, packaging, product, and system engineering teams while gaining hands-on semiconductor

Qualifications

• Pursuing a Master's or Ph.D. and returning to the degree program after the internship.
• Strong foundation in CMOS, digital/mixed-signal design, semiconductor devices, computer architecture, memory systems, or related fields.
• Experience with engineering analysis, modeling, or simulation through graduate research, coursework, labs, or internships.
• Ability to define assumptions, perform technical analysis, and communicate evidence-based conclusions.
• Strong problem-solving and both written and verbal communication skills.

Responsibilities

• Analyze HBM and DRAM architecture tradeoffs using analytical, simulation, and AI-assisted methods.
• Develop first-order models, simulations, and data-analysis tools for comparing design alternatives.
• Collaborate with architecture, circuit design, verification, layout, packaging, product, and system engineering teams.
• Review simulation, experimental, and silicon data to perform root-cause analysis and improve model accuracy.
• Apply LLMs and Generative AI to enhance analysis and document findings.

Skills

Analytical thinking

Problem-solving

Communication (written)

Communication (verbal)

Education

Master's or PhD in Electrical/Computer Engineering

Tools

HSPICE

FineSim

Spectre

Job description

Micron Technology is seeking an HBM Design Architect Intern in Richardson, TX. You will work with experienced architects to evaluate HBM/DRAM concepts, develop analytical models, and explore design tradeoffs affecting performance, power, and reliability.

The role leverages AI-assisted engineering workflows and LLMs for design exploration. You will collaborate across architecture, design, verification, packaging, product, and system engineering teams while gaining hands-on semiconductor