Hands-On Semiconductor Packaging Engineer

Palomar Technologies

Carlsbad (CA)

On-site

USD 90,000 - 120,000

Full time

14 days+

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Job summary

Palomar Technologies’ Advanced Solutions Division (ASD) seeks a Process Engineer II to join our hands-on team. You will work in the cleanroom/lab on die bonders, wire bonders, pick-and-place systems, and related equipment to develop and optimize back-end processes.

You will translate customer requirements into repeatable equipment recipes, support prototypes and higher-volume transfers, and gain cross-training opportunities in active alignment for photonics as needed.

Qualifications

Bachelor’s degree or equivalent in Engineering, Materials Science, Physics, or related field.
Typically 3–7 years of relevant process engineering experience in semiconductor packaging or related environments.
Hands-on experience with back-end semiconductor assembly equipment.
Ability to read drawings, specifications, tolerances, and assembly requirements.
Willingness to spend significant time in cleanroom/lab environments.
Strong problem-solving, communication, and documentation skills.

Responsibilities

Develop, optimize, and execute microelectronics assembly processes (die attach, wire bonding, die bonding, wedge/ball bonding, vacuum soldering, dispensing, curing).
Program, troubleshoot, and operate back-end packaging equipment in the cleanroom/lab.
Translate customer requirements into practical process plans and recipes.
Transfer processes to customer or OSAT environments and support prototypes or low-volume builds.
Collaborate with customers to understand requirements, constraints, and expected outcomes.
Document recipes, settings, tooling, inspection results, and learnings for repeatability.