Process Engineer, Advanced Packaging & Die Bonding

Fabrinet West; Santa Clara (CA); On-site; USD 119,000 - 161,000; Full time

Job summary

Fabrinet West in Santa Clara, CA is seeking an engineer to develop and optimize die attach and wire bond processes for prototype, NPI, and production assemblies in the advanced packaging cleanroom.

You will create and qualify machine/process recipes for die bonder, wire bonder, plasma cleaner, epoxy dispenser, and optical alignment equipment, while leading root cause analysis and defining inspection criteria.

Qualifications

• 0-1 year experience in cleanroom manufacturing environment
• Understand principle for die bonding in microelectronics
• Basic Programming Python, Excel for data analysis

Responsibilities

• Develop and optimize die attach and wire bond processes for prototype, NPI, and production assemblies in the advanced packaging cleanroom.
• Create and qualify machine/process recipes for die bonder, wire bonder, plasma cleaner, epoxy dispenser, and active optical alignment equipment.
• Create, improve and document optical splicing and routing for fiber optics box build assembly.
• Lead root cause analysis and corrective actions for process excursions.
• Establish inspection criteria, acceptance procedures, and metrology methods for optical and photonic sub-assemblies.
• Design and order necessary tooling and ensure availability of all consumables

Skills

Python

Excel

Data analysis

Die bonding

Education

BS in Mechanical Engineering

BS in Electrical Engineering

BS in Manufacturing Engineering

BS in Optical Engineering

BS in Physics

Job description

Fabrinet West in Santa Clara, CA is seeking an engineer to develop and optimize die attach and wire bond processes for prototype, NPI, and production assemblies in the advanced packaging cleanroom.

You will create and qualify machine/process recipes for die bonder, wire bonder, plasma cleaner, epoxy dispenser, and optical alignment equipment, while leading root cause analysis and defining inspection criteria.