Process Engineer - Advanced Packaging

Fabrinet; Santa Clara (CA); On-site; USD 85,000 - 120,000; Full time

Job summary

Fabrinet in Santa Clara seeks a manufacturing engineer to develop and optimize die attach and wire bond processes for prototype, NPI, and production assemblies in the advanced packaging cleanroom.

You will create and qualify machine recipes for die bonder, wire bonder, plasma cleaner, epoxy dispenser and optical alignment equipment, while leading root cause analysis and establishing inspection criteria for optical sub-assemblies.

Qualifications

• BS degree in a relevant engineering field.
• Experience in cleanroom microelectronics manufacturing.
• Basic programming with Python and Excel for data analysis.

Responsibilities

• Develop and optimize die attach and wire bond processes for prototype, NPI, and production assemblies in the advanced packaging cleanroom.
• Create and qualify machine/process recipes for die bonder, wire bonder, plasma cleaner, epoxy dispenser, and active optical alignment equipment.
• Create, improve and document optical splicing and routing for fiber optics box build assembly.
• Lead root cause analysis and corrective actions for process excursions.
• Establish inspection criteria, acceptance procedures, and metrology methods for optical and photonic sub-assemblies.
• Design and order necessary tooling and ensure availability of all consumables.

Skills

Die attach & wire bond

Python programming

Excel for data analysis

Education

BS in Mechanical Engineering

BS in Electrical Engineering

BS in Manufacturing Engineering

BS in Optical Engineering

BS in Physics

Tools

Die bonder

Wire bonder

Plasma cleaner

Epoxy dispenser

Active optical alignment equipment

Job description

PURPOSE:

- To support new customer ramp up plan for SIPHOG production 2027 in clean room advance packaging assemblies (D/A W/B)

PRINCIPLE ACCOUNTABILITIES / DUTIES:

• Develop and optimize die attach and wire bond processes for prototype, NPI, and production assemblies in the advanced packaging cleanroom.
• Create and qualify machine/process recipes for die bonder, wire bonder, plasma cleaner, epoxy dispenser, and active optical alignment equipment.
• Create, improve and document optical splicing and routing for fiber optics box build assembly.
• Lead root cause analysis and corrective actions for process excursions.
• Establish inspection criteria, acceptance procedures, and metrology methods for optical and photonic sub-assemblies.
• Design and order necessary tooling and ensure availability of all consumables

  PREVIOUS EXPERIENCE REQUIRED: (include experience required with specific software applications, equipment, or specific certifications and education requirements such as MSME, MSEE, APICS, etc)

  Preferred Qualifications (nice to have skills): 0-1 year experience in cleanroom manufacturing environment
  Understand principle for die bonding in microelectronics
  Basic Programming python, Excel for data analysis Education or Training: BS degree required in Mechanical Engineering, Electrical Engineering, Manufacturing Engineering, Optical Engineering, or Physics.