Lead Process Engineer – Advanced Packaging & Photonics

Actalent; California (MO); On-site; USD 120,000 - 180,000; Full time

Job summary

Actalent in Carlsbad, CA is seeking a Senior Process Engineer to develop, optimize, and scale advanced manufacturing and packaging processes for optoelectronic and silicon photonics products. You will lead process development for flip chip assembly and thermo-compression bonding, and support 2.5D and 3D packaging architectures.

This high-visibility role requires collaboration with optics and electronics teams, DOE studies, and travel up to 20% to partners in Asia and domestic sites to drive

Qualifications

• 5+ years of process engineering experience in semiconductor or photonics environments.
• Proven experience with flip chip packaging and die-to-wafer/wafer-level packaging.
• Experience with DOE, FMEA, yield analysis, and SPC methodologies.
• Strong analytical and cross-functional collaboration skills.

Responsibilities

• Develop, refine, and optimize manufacturing processes for optoelectronic and silicon photonics products.
• Lead packaging processes with focus on flip chip assembly and thermo-compression bonding (TCB).
• Support 2.5D and 3D packaging architectures for next-gen products.
• Coordinate with optics, electronics, and process engineering teams to design experiments and DOE studies.
• Monitor process health, yield metrics, and failure trends to drive improvements.

Skills

Flip chip packaging

Thermo-Compression Bonding

DOE

FMEA

Statistical process control

Yield analysis

Cross-functional collaboration

Packaging reliability

Education

Bachelor's degree in Engineering/Physics/Materials Science

Tools

JMP

Minitab

Job description

Actalent in Carlsbad, CA is seeking a Senior Process Engineer to develop, optimize, and scale advanced manufacturing and packaging processes for optoelectronic and silicon photonics products. You will lead process development for flip chip assembly and thermo-compression bonding, and support 2.5D and 3D packaging architectures.

This high-visibility role requires collaboration with optics and electronics teams, DOE studies, and travel up to 20% to partners in Asia and domestic sites to drive