Advanced Packaging Substrate Supplier Enablement Lead

Intel Corporation; Chandler (AZ); On-site; USD 164,000 - 232,000; Full time

Benefits offered by this job

Stock bonuses

Health benefits

Paid vacation

Job summary

Intel Corporation's Advanced Packaging Technology Development (APTD) Substrate and Wafer Assembly organization seeks a leader to drive supplier development and qualification for high-density FCBGA, EMIB-T, and glass core substrates.

You will coordinate with cross-functional engineering teams and supplier partners, manage readiness milestones, and apply data-driven problem solving to enable reliable manufacturing and continuous improvement across high-volume production environments.

Qualifications

• Bachelor's degree plus 9+ years of relevant experience OR Master's with 6+ years OR PhD with 4+ years.
• Experience with process integration methodologies and tools in semiconductor manufacturing.
• Experience in advanced packaging, substrates, or semiconductor process development.

Responsibilities

• Define process integration roadmaps and establish manufacturing procedures to meet technology transfer milestones.
• Extract insights from structured and unstructured data, applying statistical analysis and coding techniques for yield improvement.
• Lead low yield analysis and corrective actions to address quality excursions in high-volume production environments.
• Drive continuous improvement initiatives to minimize defects and optimize process reliability.
• Assess quality and reliability risks for manufacturing material and process changes, ensuring sustained product performance.
• Collaborate with internal teams and external stakeholders to align process strategies with program goals.

Skills

Structured problem solving

Data-driven decision making

Supplier management

Cross-functional collaboration

Communication skills

Education

Bachelor's degree in engineering/physics/materials science or related

Master's degree in engineering/physics/materials science or related

PhD in engineering/physics/materials science or related

Tools

Process integration tools

Advanced packaging tools

Job description

Job Details:

Job Description:

The Advanced Packaging Technology Development (APTD) Substrate and Wafer Assembly organization is responsible for developing cutting edge substrate packaging and wafer assembly solutions for our customers. As a member of the Substrate Technology and Manufacturing Group, you will play a critical role in enabling new manufacturing capacity across advanced packaging suppliers.

In this position, you will lead substrate supplier development and qualification activities for advanced technologies such as high density FCBGA, EMIB-T and glass core substrate, ensuring suppliers achieve the required readiness to support growing customer demand. This includes driving technical enablement, managing readiness milestones, and collaborating closely with cross functional engineering teams and supplier partners. A combination of detail-oriented project management, strong technical risk assessment / problem solving skills, and effective supplier / stakeholder management will be needed to be successful.

Please note: This role requires periodic evening meetings with suppliers in East Asia, as well as occasional travel to supplier sites to support essential program objectives.

Key Responsibilities

• Define process integration roadmaps and establish manufacturing procedures to meet technology transfer milestones.
• Extract insights from structured and unstructured data, applying statistical analysis and coding techniques for yield improvement.
• Lead low yield analysis and corrective actions to address quality excursions in high-volume production environments.
• Drive continuous improvement initiatives to minimize defects and optimize process reliability.
• Assess quality and reliability risks for manufacturing material and process changes, ensuring sustained product performance.
• Collaborate with internal teams and external stakeholders to align process strategies with program goals.

Behavioral traits

• Demonstrated expertise in structured problem solving and data-driven decision-making.
• Proven leadership in supplier management and technology enablement.
• Strong collaboration, influencing, and communication skills across global, cross-functional teams.
• Strategic mindset with the ability to align technical solutions with organizational objectives.
• Enthusiasm for innovation, mentoring, and contributing to Intel’s technical leadership.

Qualifications:

Minimum Qualifications

• Bachelor’s degree in engineering, physics, materials science, or a related field, with 9+ years of relevant experience; or
• Master’s degree in engineering, physics, materials science, or a related field, with 6+ years of relevant experience; or
• PhD in engineering, physics, materials science, or a related field, with 4+ years of relevant experience.

• The experience listed above should be a combination of the following:

• Proficiency in process integration methodologies and tools used in semiconductor manufacturing environments.
• Experience in advanced packaging, substrates, or semiconductor process development.

Join us in shaping the future of manufacturing with your expertise and passion for technology development.

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location:

US, Arizona, Phoenix

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $164,100.00-231,670.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

*

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.