Field Applications Engineer - AI/Datacom Solutions

Molex; Seattle (WA); On-site; USD 150,000 - 190,000; Full time

Job summary

Molex seeks a dynamic Field Application Engineer to lead technical engagements and remove design barriers for Infotech customers, promoting high-speed copper solutions and Datacom & Specialty Solutions products.

You will drive design wins, collaborate with customer engineering and Molex teams, and develop demos and application notes to support sales and product marketing in the Infotech/Datacom space.

Qualifications

• Bachelor's degree in engineering or related field required.
• At least 3 years in electronics engineering with customer interaction.
• Experience with high-speed interconnects and PCB/board design is advantageous.

Responsibilities

• Support customer engineering and sales to secure design wins and a convertible Salesforce pipeline.
• Establish strategic technical relationships with key engineering contacts with the customer.
• Collaborate with customer development/process/reliability engineers to resolve design-in issues for High Speed I/O, Backplane/BTB/Storage Connectors/Cables.
• Provide demos and customer-facing presentations on technical concepts.
• Share knowledge with other Molex FAEs in the Infotech/Datacom space.
• Coordinate with Product Management, Global Sales and SI teams.

Skills

Customer interaction

Project leadership

Problem solving

Optics

High-speed interconnects

PCIe

Signal integrity

Thermal/Mechanical modeling

Education

Bachelor's degree in Engineering

Master's degree in Engineering

Tools

NX CAD

CAD tools

Job description

Molex seeks a dynamic Field Application Engineer to lead technical engagements and remove design barriers for Infotech customers, promoting high-speed copper solutions and Datacom & Specialty Solutions products.

You will drive design wins, collaborate with customer engineering and Molex teams, and develop demos and application notes to support sales and product marketing in the Infotech/Datacom space.