EUV Lithography & Materials Intern — Shape Next-Gen Chips

Micron; Boise (ID); On-site; USD 28,000 - 48,000; Full time

Benefits offered by this job

Medical, dental and vision plans

Paid time off

Paid holidays

Accommodations for accessibility and a

Job summary

Micron Technology in Boise, Idaho, invites you to an EUV Lithography & Materials Intern role focused on photolithography process development, materials optimization, and patterning improvements. You will work with Photolithography, Metrology, Dry Etch, and Wet Process teams.

You will design DOE experiments, analyze data with CD-SEM tools, and apply AI methods to drive research and reporting. This role emphasizes collaboration and hands-on engineering progress through Fall 2027.

Qualifications

• Pursuing or completed degree in Engineering, Chemistry, Materials Science, Photolithography, or related field.
• Strong analytical, communication, and independent-work capabilities.
• Demonstrated problem-solving and ability to meet timelines.

Responsibilities

• Design and execute experiments using DOE to optimize photolithography processes, including EUV lithography.
• Plan and perform experiments in cleanroom environments with cross-site collaboration.
• Analyze data and imaging results using in-house and commercial tools; communicate findings.
• Apply AI and data-driven methods to support research and process optimization.
• Prepare technical reports and presentations on project progress and conclusions.

Skills

Analytical skills

Problem solving

Written and verbal communication

Independent work

Time management

Education

Bachelor's/Master's/PhD in Engineering/Materials Science/Photolithography or related

Tools

DOE methodologies

Statistical analysis

Programming for scientific computing

AI/data-driven methods

CD-SEM analysis tools

Job description

Micron Technology in Boise, Idaho, invites you to an EUV Lithography & Materials Intern role focused on photolithography process development, materials optimization, and patterning improvements. You will work with Photolithography, Metrology, Dry Etch, and Wet Process teams.

You will design DOE experiments, analyze data with CD-SEM tools, and apply AI methods to drive research and reporting. This role emphasizes collaboration and hands-on engineering progress through Fall 2027.