Edge AI Pre-Sales Engineer: Solutions & BOM

ADP, Inc.; Fremont (CA); On-site; USD 95,000 - 105,000; Full time

Job summary

ADP, Inc. in Fremont, CA is seeking a Technical Sales Representative (Pre-Sales) to drive opportunity qualification and solution sizing within the Edge AI ecosystem alliance.

You will collaborate with customers and partners to translate requirements into hardware configurations and prepare technical responses. The role requires 4+ years in pre-sales or related technical fields, with strong knowledge of hardware architectures and RFP/RFQ processes, and will involve up to 10% travel to customer

Qualifications

• 4+ years in a customer-facing Pre-Sales, Applications Engineering, or Technical Support role in IPC/embedded/edge hardware sectors.
• Solid understanding of x86 and ARM architectures, memory, PCIe, storage interfaces, and industrial I/O.
• Experience reading and responding to technical RFP/RFQ/RFI documents, specs, and drawings.

Responsibilities

• Pre-Sales Evaluation & Opportunity Qualification: assess feasibility and determine optimal hardware configurations.
• Hardware Sizing & BOM Generation: translate workloads into BOMs and sizing.
• RFP/RFQ Technical Leadership: drive technical response sections and ensure compliance matrices are addressed.
• Product Marketing: create customer-facing materials for verticals such as Smart transportation, manufacturing, robotics, and security.

Skills

Pre-Sales

Hardware sizing

RFP/RFQ

Technical documentation

Customer-facing

Education

Associate's or Bachelor's degree in Electrical/Computer Engineering/CS or equivalent

Tools

Docker

Linux/Ubuntu

Job description

ADP, Inc. in Fremont, CA is seeking a Technical Sales Representative (Pre-Sales) to drive opportunity qualification and solution sizing within the Edge AI ecosystem alliance.

You will collaborate with customers and partners to translate requirements into hardware configurations and prepare technical responses. The role requires 4+ years in pre-sales or related technical fields, with strong knowledge of hardware architectures and RFP/RFQ processes, and will involve up to 10% travel to customer