DRAM Process Integration Engineer - Global Tech Transfer

Micron Memory Malaysia Sdn Bhd; Boise, Northern (ID, KY); Hybrid; USD 100,000 - 140,000; Full time

Benefits offered by this job

Medical plan

Dental plan

Vision plan

Paid time off

Job summary

Micron Technology seeks a Process Integration Engineer to join the Advanced Technology and Engineering team in Boise, ID. You will coordinate DRAM transfer from TD/other fabs to the Boise facility, drive yield improvements, and support cost reduction and quality enhancements across production ramp.

The role requires a Bachelor's degree in engineering with 3+ years of HVM/FAB experience and 2+ years in semiconductor fabrication, with willingness to travel internationally for tech transfer.

Qualifications

• Bachelor's degree in engineering with 3+ years HVM/FAB experience.
• 3+ years memory (DRAM) experience.
• 2+ years in semiconductor fabrication focused on yield ramp, cost reduction, quality improvement.

Responsibilities

• Act as a module owner for root cause investigations and failure analysis in time-sensitive environments.
• Drive improvements in yield, cost efficiency, and quality.
• Run DOE to enhance process capability and margin.
• Lead tech transfer activities and support device ramp-up.

Skills

HVM/FAB experience

Memory (DRAM) experience

Yield improvement

Device reliability knowledge

Shift work flexibility

Education

Bachelor's degree in engineering

Master's or PhD preferred

Tools

Design of Experiments (DOE)

Tech transfer experience

Job description

Micron Technology seeks a Process Integration Engineer to join the Advanced Technology and Engineering team in Boise, ID. You will coordinate DRAM transfer from TD/other fabs to the Boise facility, drive yield improvements, and support cost reduction and quality enhancements across production ramp.

The role requires a Bachelor's degree in engineering with 3+ years of HVM/FAB experience and 2+ years in semiconductor fabrication, with willingness to travel internationally for tech transfer.