Boise DRAM Process Integration Engineer – Yield & Transfer

Micron; Boise (ID); On-site; USD 120,000 - 180,000; Full time

Benefits offered by this job

Medical plans

Dental plans

Vision plans

Paid time off

Job summary

Micron Technology, Inc. in Boise, Idaho, is seeking a Senior Process Integration Engineer to drive advanced DRAM process transfers and yield improvements in a greenfield fab. You will lead cross-functional teams to qualify processes, tools, and materials while optimizing margin and reliability.

This role requires 5+ years in semiconductor fab or HVM, DOE experience, and strong data analysis skills, with willingness to travel internationally as needed for training or assignments.

Qualifications

• Bachelor's degree in Engineering or related technical field required.
• 5+ years of semiconductor fab or HVM experience, including memory technologies.
• 3+ years in process integration, yield ramp, or quality improvement.
• Strong understanding of transistor operation, device scaling, and reliability.
• Experience with DOE, data analysis, and problem-solving methodologies.

Responsibilities

• Lead module ownership including root cause analysis and fast-paced failure investigation.
• Drive yield, cost, and quality improvements using data-driven methodologies.
• Develop and execute DOE to improve process capability, margin, and stability.
• Lead technology transfer and yield ramp from TD or HVM fabs into Boise (ID1).
• Coordinate cross-functional teams to qualify processes, tools, and materials.

Skills

DOE methodology

Root cause analysis

Data analysis

Cross-functional collaboration

Problem solving

Education

Bachelor's degree in Engineering or related technical field

Tools

FMEA

8D problem solving

SPC

Job description

Micron Technology, Inc. in Boise, Idaho, is seeking a Senior Process Integration Engineer to drive advanced DRAM process transfers and yield improvements in a greenfield fab. You will lead cross-functional teams to qualify processes, tools, and materials while optimizing margin and reliability.

This role requires 5+ years in semiconductor fab or HVM, DOE experience, and strong data analysis skills, with willingness to travel internationally as needed for training or assignments.