DRAM Process Integration Lead - Yield & Tech Transfer

Micron Technology, Inc.

Boise (ID)

Hybrid

USD 120,000 - 160,000

Full time

11 days ago

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Job summary

Micron Technology, Inc. in Boise, Idaho, invites a Senior Process Integration Engineer to join our Advanced Technology and Engineering group. You will lead module ownership, drive yield and quality improvements, and manage technology transfer from TD or HVM fabs into our Boise facility.

Expect cross-functional collaboration across devices, process, and manufacturing teams. The role emphasizes DOE-driven process optimization, data analysis, and problem solving, with potential international travel

Qualifications

  • Bachelor's degree in Engineering or related technical field.
  • 5+ years of semiconductor fab or HVM experience, including memory technologies.
  • 3+ years in process integration, yield ramp, or quality improvement.
  • Strong understanding of transistor operation, device scaling, and reliability.
  • Experience with DOE, data analysis, and problem-solving methodologies.
  • Willingness to travel internationally for training and/or work on shift as needed.

Responsibilities

  • Lead module ownership including root cause analysis and fast-paced failure investigation.
  • Drive yield, cost, and quality improvements using data-driven methodologies.
  • Develop and execute DOE to improve process capability, margin, and stability.
  • Lead technology transfer and yield ramp from TD or HVM fabs into Boise (ID1).
  • Coordinate cross-functional teams to qualify processes, tools, and materials.

Skills

Data analysis
DOE
Problem solving

Education

Bachelor's degree in Engineering
Master’s or PhD in related field

Job description

Micron Technology, Inc. in Boise, Idaho, invites a Senior Process Integration Engineer to join our Advanced Technology and Engineering group. You will lead module ownership, drive yield and quality improvements, and manage technology transfer from TD or HVM fabs into our Boise facility.

Expect cross-functional collaboration across devices, process, and manufacturing teams. The role emphasizes DOE-driven process optimization, data analysis, and problem solving, with potential international travel

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