DRAM Build & Test Intern — AI‑Driven Analysis

Micron Technology; Boise (ID); On-site; USD 28,000 - 41,000; Part time

Benefits offered by this job

Medical, dental and vision plans

Paid time off

Paid holidays

Job summary

Micron Technology seeks an Engineering Intern to join the DRAM Build Enablement and Test Structure Engineering team in Boise. You will contribute to design, layout, verification, and analysis of semiconductor test structures for next‑gen DRAM technologies, with hands‑on use of EDA tools and silicon evaluation methods.

You will develop test structures, perform data analysis, and automate tasks with Python/Tcl/Perl.

Qualifications

• Pursuing a Bachelor's or equivalent; cannot graduate prior to September 2027.
• Basic understanding of semiconductor devices and circuit fundamentals.
• Experience with coding or scripting languages such as Python, Tcl, or Perl.

Responsibilities

• Develop and arrange semiconductor test structures (TEGs) for advanced DRAM nodes.
• Support physical verification activities, including DRC and LVS.
• Analyze electrical characterization results and generate technical reports; write automation scripts to boost efficiency.

Skills

Python

Tcl

Perl

Education

Bachelor's degree in Electrical Engineering or related field

Tools

Cadence Virtuoso

Calibre

Job description

Micron Technology seeks an Engineering Intern to join the DRAM Build Enablement and Test Structure Engineering team in Boise. You will contribute to design, layout, verification, and analysis of semiconductor test structures for next‑gen DRAM technologies, with hands‑on use of EDA tools and silicon evaluation methods.

You will develop test structures, perform data analysis, and automate tasks with Python/Tcl/Perl.